Samsung Electronics Co., Ltd.

Seung-Hoon Ahn

Seung-Ki Chae

Seung-Un Kim

Sue-Ryeon Kim

Je-Gu Lee

Seok-Hee Park

A computer-controlled slurry supplying apparatus for providing abrasive slurry to a chemical mechanical polishing (CMP) machine in a semiconductor manufacturing process preferably comprises a storage portion for accepting and storing a quantity of undiluted slurry, a mixing portion for accepting undiluted slurry from the storage portion and mixing with a diluting solution to created a diluted slurry, a supply portion for holding the diluted slurry, and at least one point-of-use mixing unit for mixing at least one chemical additive to the diluted slurry at or near a dispensing nozzle at the point of application. Each of the above portions of the slurry supplying apparatus further includes a re-circulation means for keep solutions in a mixed and agitated state. A method for using the slurry supplying apparatus comprises steps of controllably operating various valves, pumps, and sensors to maintain a desired slurry composition and flow rate.

Method of supplying slurry and a slurry supply apparatus having a mixing unit at a point of use

A conveying apparatus conveys articles used for manufacturing semiconductor devices. The conveying apparatus has a conveying rail section that includes a first rail providing a first conveying route, a second rail providing a second conveying route, and an intermediate rail structure interconnecting the first and second rails. Respective vehicles are fitted to the first and second rails so as to convey articles as supported atop the first rail or as suspended from the second rail, respectively. The conveying apparatus can be readily installed in the bay of an automatic manufacturing system, e.g., of a type for processing wafers having a diameter of 300 mm. In this case, the conveying route of the articles is unified, and space is saved, as well.

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Yongin, South Korea

Seung-Hoon Ahn