Samsung Electro-mechanics Co., Ltd.

Hynix Semiconductor Inc.

Korea Institute of Science and Technology

Seung Hee Hong

Sang Jong Lee

Eun Soo Kim

Su Bong Jang

Min Ki Jung

Cheol Mo Jeong

Hee Soo Yoon

Jung Geun Kim

Seung Jae Song

Whee Won Cho

Han Bit Kim

Young Bok Yoon

Nam Ki Park

Jae Woon Park

Seong Hwan Myung

Suk Joong Kim

Jin Yoo Suh

Dong Ik Kim

A camera module includes: a housing in which a lens module is accommodated; and a shake correction portion including first and second movable yokes mounted on the lens module and first and second coil portions disposed to oppose the first and second movable yokes, respectively. The first coil portion is configured to attract the first movable yoke in response to power being applied to the first coil portion. The second coil portion is configured to attract the second movable yoke in response to power being applied to the second coil portion.

Camera module

An inductor includes a body including a plurality of insulating layers and a plurality of coil patterns are disposed on each of the plurality of insulating layers, and first and second external electrodes disposed on an external surface of the body. The plurality of coil patterns are connected to each other by coil connecting portions and both end portions thereof are electrically connected to the first and second external electrodes through coil lead portions, respectively, to form a coil. The plurality of coil patterns include coil patterns disposed on an outer portion of the body and coil patterns disposed on an inner portion of the body, the coil patterns disposed on the inner portion of the body include first coil patterns electrically connected in parallel, and at least one of the first coil patterns includes an internal side portion having a shape different from shapes of remaining coil patterns.

Inductor

An inductor includes a body including a coil and a dummy electrode, spaced apart from the coil, and having a first side surface and a second side surface disposed to oppose each other in a first direction, a top surface and a bottom surface disposed to oppose each other in a second direction, and a first end surface and a second end surface disposed to oppose each other in a third direction, and external electrodes including a first external electrode, disposed on an external surface of the body, extending from the first end surface to a portion of the bottom surface and a second external electrode, disposed on an external surface of the body, extending from the second end surface to a portion of the bottom surface.

A camera module includes a housing, a frame disposed in an interior space of the housing, a movable body, a lens holder, first and second optical image stabilization (OIS) actuators. The movable body is configured to move in a first direction, perpendicular to an optical axis. The lens holder is configured to move in a second direction perpendicular to the first direction. The first OIS actuator is configured to move the movable body in the first direction. The second OIS actuator is configured to move the lens holder in the second direction. The frame includes a first opening through which a first OIS coil and a first OIS magnet of the first OIS actuator are disposed to face each other, and a second opening through which a second OIS coil and a second OIS magnet of the second OIS actuator are disposed to face each other.

A coil component includes a body including an internal coil and including an upper surface and a lower surface opposing each other in a thickness direction thereof; a first external electrode connected to one end of the internal coil; and a second external electrode connected to the other end of the internal coil. The first external electrode and the second external electrode may be formed on the same one side portion of the lower surface of the body.

Coil component

A coil component includes a body including an internal coil and first and second external electrodes respectively disposed on outer surfaces of the body. The first and second external electrodes extend from a lower surface of the body to first and second end surfaces connected thereto, respectively. The first external electrode on the first end surface and the second external electrode on the second end surface each include a base portion and an extending portion extending from the base portion in a height direction, having a predetermined height, and having a width narrower than a width of the base portion.

A coil component includes: a body; a coil part including a coil pattern embedded in the body and having at least one turn winding around on one direction; first and second external electrodes disposed on a surface of the body and connected to the coil part; and a shielding via having a permeability higher than that of the body and extending along the one direction in the body.

An inductor includes a body including insulating layers stacked therein, in which coil patterns are respectively disposed on the insulating layers, and first and second external electrodes disposed on an external surface of the body, wherein the coil patterns are connected to each other by a plurality of coil connecting portions, and opposing ends thereof are connected to the first and second external electrodes through coil lead portions, respectively, to form a coil, the coil patterns include outer coil patterns disposed in an outer portion of the body and inner coil patterns disposed in an inner portion, a first coil connecting portion connects the outer coil patterns and a second coil connecting portion connects one coil pattern of the outer coil patterns and another coil pattern of the inner coil patterns, and the first and second coil connecting portions are disposed in a staggered manner.

A composite electronic component includes a body including a capacitor unit and an inductor unit and having a plurality of insulating layers stacked in a first direction perpendicular to a mounting surface of the body. A plurality of external electrodes are on external surfaces of the body. The capacitor unit includes first and second internal electrodes alternately stacked with insulating layers interposed therebetween. The inductor unit includes a coil including coil patterns having a spiral shape, on respective insulating layers, and connected together.

Composite electronic component and board having the same

A camera module includes a housing including a lens module; a diaphragm module to form N apertures of different sizes, where N is a natural number, with blades disposed on an object side of the lens module; and a diaphragm driving unit disposed with the diaphragm module, and including a driving coil and a magnetic member disposed opposite to the driving coil, the magnetic member being movable in a direction perpendicular to an optical axis to be fixed in N positions along a movement path.

A thin film capacitor includes a body including a dielectric layer, a first internal electrode layer and a second internal electrode layer, a melting point of a material included in the first internal electrode layer being lower than a melting point of a material included in the second internal electrode layer, and a first external electrode and a second external electrode disposed on an upper surface of the body, the second internal electrode layer being disposed on an upper surface of the first internal electrode layer and a lower surface of the first internal electrode layer opposing the upper surface of the first internal electrode layer.

Thin film capacitor

A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and first and second external electrodes disposed on one surface of the body and respectively connected to the first and second internal electrodes. The first internal electrode includes a first main portion and a first lead out portion connecting the first main portion and the first external electrode, the second internal electrode includes a second main portion and a second lead out portion connecting the second main portion and the second external electrode, and the second main portion has a greater area than the first main portion and includes a corner portion defining an open space to compensate for a capacitance formed by an area in which the first lead out portion and the second main portion overlap each other.

Multilayer ceramic capacitor

The present invention relates to semiconductor devices and a method of fabricating the same. According to a method of manufacturing semiconductor devices, there is first provided a semiconductor substrate in which a first pre-metal dielectric layer including trenches is formed. A diffusion barrier layer is formed on the entire surface including the trenches. A metal layer is formed on the diffusion barrier layer including the trenches, thereby gap-filling the trenches. A polish etching process is performed on the metal layer and the diffusion barrier layer so that the diffusion barrier layer and the metal layer remain within the trenches. An etching process of lowering a height of the metal layer is performed in order to increase a distance between metal lines. A capping layer is formed on the entire surface including exposed sidewalls of the first pre-metal dielectric layer. A second pre-metal dielectric layer is formed over the capping layer.

Method of manufacturing semiconductor devices having metal lines

A method of forming an isolation layer of a semiconductor device is disclosed herein, the method comprising the steps of providing a semiconductor substrate in which a tunnel insulating layer and a charge storage layer are formed on an active area and a trench is formed on an isolation area; forming a first insulating layer for filling a lower portion of the trench; forming a porous second insulating layer on the first insulating layer for filling a space between the charge storage layers; forming a third insulating layer on a side wall of the trench and the second insulating layer, the third insulating layer having a density higher than that of the second insulating layer; and forming a porous fourth insulating layer for filling the trench.

Method of forming isolation layer of semiconductor device

A semiconductor device includes contact plugs formed in contact holes defined in an interlayer dielectric. Upper portions of the contact plugs are etched. A first barrier layer is formed on a surface of the interlayer dielectric including the contact plugs. A second barrier layer is formed on the first barrier layer over the interlayer dielectric. The second barrier layer has lower compatibility with a metallic material than the first barrier layer. A first metal layer is formed over the first and second barrier layers. The first metal layer, the first barrier layer and the second barrier layer are then patterned.

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Seoul, South Korea

Seung Hee Hong