Samsung Electro-Mechanics Co., Ltd.

Seung Goo Jang

Eun Kyoung Kim

Jeong Ki Ryoo

Nam Ki Kim

Sang Hyun Kim

Se Min Jin

Tae Hyun Kim

Hong In Kim

Thomas A Kim

Jung Hyun Lim

Hyung Geun Ji

Min Hoon Kim

Jae Hyun Chang

Nack Gyun Seong

An antenna module includes a connection member, an integrated circuit (IC) on a first surface thereof, and an antenna package on a second surface thereof. The connection member includes a wiring layer and an insulating layer. The IC is electrically connected to the wiring layer. The antenna package includes first antenna members and feed vias each electrically connected to a corresponding one of the first antenna members and a corresponding wire of the wiring layer. A feed line is electrically connected to a wire of the wiring layer and extends in a side direction of the second surface, a second antenna member is electrically connected to the feed line and is configured to transmit and/or receive an RF signal in the side direction, and a director member is spaced apart from the second antenna member in the side direction and has an inside boundary oblique to the second antenna member.

Antenna module and antenna apparatus

An antenna includes feed pads; a radiating portion disposed on one side of the feed pads and spaced apart from the feed pads, the radiating portion being constituted by a single conductor plate; and a ground part disposed on an opposite side of the feed pads from the radiating portion; wherein each of the feed pads has a polygonal shape.

Antenna and antenna module including the antenna

Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.

Mounting module and antenna apparatus

A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.

Semiconductor package and electronic device having the same

An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.

Antenna module and dual-band antenna apparatus

A signal amplifier includes a band suppression filter configured to suppress a preset band among bands included in an input signal, a first common source-type amplifier connected between a supply terminal of a driving voltage and a ground terminal and configured to amplify a first input signal separated from an output signal of the band suppression filter in a common input node to provide a first amplified signal to a common output node, a second common source-type amplifier configured to amplify a second input signal separated from the output signal of the band suppression filter in the common input node to provide a second amplified signal to the common output node, and an output matcher configured to match levels of impedance between the common output node and an output terminal and to transfer a combined signal to the output terminal.

Concurrent dual-band signal amplifier

There is provided a band pass filter including: a first substrate including a plurality of capacitors and a plurality of conductive patterns provided thereon; and a second substrate laminated with the first substrate and connected to the plurality of first conductive patterns through a plurality of via holes, wherein an attenuation frequency is determined according to the amount and shape of the plurality of via holes.

Band pass filter

Provided is a band pass filter constituted by a printed circuit board (PCB) and a multi-layer ceramic chip (MLCC) to be mounted in a circuit, without additional parts such as a low temperature co-fired ceramic (LTCC) based filter, and so on, and it is an object to produce a band pass filter constituted by an inductor formed of a PCB pattern and a capacitor formed of an MLCC to implement a high performance and compact band pass filter. The band pass filter includes an inductor pattern part formed of a plurality of PCB patterns and having inductance; an MLCC part constituted by a plurality of MLCCs mounted in a lower end side of the inductor pattern part and having a capacitance; and a port part formed of a plurality of PCB patterns and connected to the PCB patterns extending from the inductor pattern part.

Growing community of inventors

Suwon-si, South Korea

Seung Goo Jang