Utac Headquarters Pte. Ltd.

Seung Geun Park

Dzafir Bin Mohd Shariff

Enrique Jr Sarile

Ronnie M De Villa

Zhong Hai Wang

A semiconductor package is disclosed. The semiconductor package includes a substrate with a first surface, a second surface and sidewalls. The package also includes backside metallization (BSM) over the second surface of the substrate. The semiconductor package is devoid of metal debris.

Semiconductor packages and methods of packaging semiconductor devices

A semiconductor package which is free of metal debris from backside metallization (BSM) is disclosed. The semiconductor package is singulated by performing a saw street open process from the frontside of the wafer and then includes a singulation process using a plasma etch from the backside of the wafer with BSM. The singulation process results in metal debris free packages.

Growing community of inventors

Singapore, Singapore

Seung Geun Park