Samsung Electro-mechanics Co., Ltd.

Lg Electronics Inc.

Industry-University Cooperation Foundation Hanyang University

Samsung Electronics Co., Ltd.

Goldstar, Co., Ltd.

Seoul National University

K. C. Tech Co., Ltd.

Seung Eun Lee

Yong Hoon Kim

Yul Kyo Chung

Yee Na Shin

Jea Gun Park

Kun Ho Lee

Kwon Han Bae

In Su Hwang

Young Kwan Lee

Joo Hwan Jung

Jin Won Lee

Jae Woong Choi

Myung Sam Kang

Chul Jun Choi

Jin Su Park

Jea Yong Yoo

Byoung Hwa Lee

Tae Ho Kim

Dong Wook Kim

Doo Hwan Lee

Ji Eun Kim

Jung Won Lee

Jung Hyun Cho

Dong Hyun Roh

Yong Ho Baek

Young Sik Hur

Jae Sung Lee

Tae Kyung Kim

Jin Young Choi

Yong Jin Lee

Hyun Gi Ahn

Joo Yeon Lee

Jong Min Choi

Seung Ryong Kook

Moon Hee Yi

Jong Hoon Won

Tae Sung Jeong

Jong Ho Park

Woo Seong Yoon

Bae Kyun Kim

Dae Hyun Park

Jun Hui Kim

Da Som Lee

Dong Hyun Lee

Du Yeong Lee

Yun Je Ji

Tae Hun Shim

Jong Ung Baek

Min Su Jeon

In Hyung Lee

Kyung Hwan Ko

Kyoung Jun Kim

Hee Sung Chae

Geun Sik Yun

Ji Yoon Park

Seung Yeop Kook

Jeong Min Park

Eun Jung Hyun

Kyung Sub Min

Moon Soo Chang

Limonov Alexandre

Dae Kwon Jung

Seung Wok Han

Joo Yoo Kim

Hyun Cheol Park

Seung Hyun Sohn

Jin Seok Moon

Min Ho Park

Ki Jung Sung

Hyun Seok Shin

Hak Chun Kim

Hyun Ju Jin

Hyung Mi Jung

Bang Chul Ko

Kwang Yun Kim

Hae Kyo Seo

Sang Yoon Lee

Chang Yul Lee

Seung Young Jeon

Dae Ung Jeong

Ik Joo Byun

Myeong Hui Jung

Sung Gun Bae

Seung Goo Lee

Dae Young Jung

Hyung Dong Kang

Ho Shik Kang

Dong Uk Kwak

Seong Mo Lee

Jong Rok Kim

Byung Ik Song

Yeong Seob Jeong

Junli Li

Song Hwa Hong

So Ree Yoo

In Ho Yun

An antenna substrate includes a skin layer containing an insulating material, a ground layer containing a conductive material, an insulating layer disposed between the skin layer and the ground layer and including an insulating material different from the insulating material of the skin layer, a plurality of patch antennas disposed between the ground layer and the skin layer, a shielding member disposed between the ground layer and the skin layer, spaced apart from the plurality of patch antennas, and connected to the ground layer, and a shielding post connected to the shielding member, and protruding further than an outer surface of the skin layer, from the shielding member in a direction facing the skin layer, at least a portion of the shielding post being disposed between the plurality of patch antennas.

Antenna substrate and electronic device including the same

A substrate polishing system may include a substrate transfer unit comprising a shaft to rotate on a rotation axis perpendicular to a ground and at least one transfer arm to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit by rotation of the shaft, and at least one carrier to perform polishing the substrate transferred by the substrate transfer unit.

Substrate polishing system

A printed circuit board includes a first core portion in which a first passive component is embedded, a second core portion in which a second passive component is embedded, and a first bonding layer disposed between the first and second core portions and including first conductive particles connected to the first and second passive components.

Printed circuit board including bonding layer, having conductive particles, disposed between core portions

A semiconductor package includes a first substrate, a first electronic component disposed on the first substrate, a second substrate disposed on the first substrate and provided with a cavity disposed in one surface of the second substrate, a first connection member connecting the first and second substrates to each other, a heat dissipation structure disposed on the second substrate and spaced apart from the first connection member, a second connection member disposed on the second substrate, and a via disposed on the second substrate, spaced apart from the heat dissipation structure, and connected to the first connection member. The second substrate includes a first region in which the cavity is disposed and a second region connected to the first substrate, and the heat dissipation structure is disposed in each of the first and second regions of the second substrate.

Semiconductor package including heat dissipation structure

A substrate cleaning line and a substrate cleaning system including the same are disclosed. The substrate cleaning line may include a chamber portion including a plurality of cleaning chambers to clean a substrate, and a first return robot to load, unload, or transfer the substrate from or to the plurality of cleaning chambers, wherein the cleaning chambers may be stacked on each other in a vertical direction.

Substrate cleaning line and substrate cleaning system comprising the same

An electronic component embedded substrate includes: an insulating material including a cavity formed in one surface thereof; a protective layer embedded in the insulating material and covering an entire bottom surface of the cavity; solders disposed on side surfaces of the cavity; and an electronic component disposed in the cavity and at least partially in contact with the solders, wherein the protective layer has a material different from that of the insulating material.

Electronic component embedded substrate

A printed circuit board (PCB) includes a substrate including a first insulating layer and first wiring patterns disposed on the first insulating layer, an optical sensing chip including a vertical cavity surface emitting laser (VCSEL) and a photodiode, disposed on the first insulating layer to be in contact with at least one of the first wiring patterns, a transimpedance amplifier (TIA) chip disposed to be spaced apart from the optical sensing chip on the first insulating layer and disposed to be in contact with at least one first wiring pattern, different from the first wiring pattern connected to the optical sensing chip, among the first wiring patterns, and a dielectric layer stacked on the substrate and having a hole exposing the VCSEL and the photodiode of the optical sensing chip. The optical sensing chip and the transimpedance amplifier chip are connected through a wiring pattern disposed on the dielectric layer.

Printed circuit board and printed circuit board package

A substrate structure and electronic device provide improved power integrity and simplified manufacturing. The substrate structure includes a first printed circuit board, having a first side and a second side opposing each other, and a plurality of passive components embedded in the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components and a smallest distance between adjacent second passive components.

Substrate structure and electronic device including the same

A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers and having a cavity penetrating through a portion of the plurality of insulating layers, a passive component disposed in the cavity and including an external electrode electrically connected to at least one of the plurality of wiring layers, and a bridge disposed on the passive component in the cavity and including one or more circuit layers electrically connected to the external electrode.

Printed circuit board and method of manufacturing the same

The present disclosure relates to a printed circuit board. The printed circuit board includes: a plurality of insulating layers; a plurality of circuit layers disposed on at least one of an interior and an exterior of the plurality of insulating layers; and a reinforcing layer disposed on one surface of the plurality of insulating layers, and having a first opening having a first width and a second opening having a second width, different from the first width.

Printed circuit board

A substrate structure includes a first printed circuit board having a first side and a second side opposing each other, and a plurality of passive components connected to the first side of the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components of the plurality of first passive components and a smallest distance between adjacent second passive components of the plurality of second passive components. An electronic device includes a first printed circuit board disposed on a mainboard and having, on opposite sides thereof, a semiconductor chip and a plurality of passive components.

A substrate having an electronic component embedded therein includes first and second insulating layers including first and second cavities, respectively, first and second electronic components disposed within the first and second cavities, respectively, a first adhesive layer disposed between the first and second insulating layers, and a connection member penetrating through at least a portion of the first adhesive layer. One end and the other end of the connection member are connected to the first and second electronic components, respectively.

Substrate having electric component embedded therein

A printed circuit board includes a first insulating layer, a second insulating layer disposed on a lower surface of the first insulating layer, an electronic component embedded in the second insulating layer and at least partially in contact with the first insulating layer, a first wiring layer disposed on an upper surface of the first insulating layer, a second wiring layer disposed on a lower surface of the second insulating layer, and a first wiring via penetrating through the first and second insulating layers and connecting at least portions of the first and second wiring layers to each other.

A printed circuit board includes: a first substrate including a first cavity and first circuit units; and a second substrate disposed in the first cavity of the first substrate with an electronic component disposed therein, and including second circuit units having a higher density than the first circuit units, wherein the second substrate includes a first region and a second region, the first region of the second substrate includes an outermost circuit layer among the second circuit units, and circuit layers in the first region of the second substrate have a higher density than circuit layers in the second region of the second substrate.

Various embodiments of the present invention relate to a method for detecting and controlling a battery status by using a sensor, and an electronic device using the same, the electronic device comprising: a housing; an accommodation part arranged inside the housing and including at least one gas sensor; a battery arranged inside the housing; a memory for storing information, acquired by the at least one gas sensor, on gas leaked from the battery and operation control information of the electronic device; and a processor electrically connected to the memory, wherein the processor is configured to acquire a detection signal of gas leaked from the battery by using the at least one gas sensor, and control the operation of at least a part of the electronic device and/or charging characteristics of the battery when the acquired gas detection signal exceeds a predetermined threshold value, so as to detect, in real time, a gas leakage of the battery occurring because of the exposure of the electronic device to high temperature or heat generation and control the battery status, thereby preventing safety accidents caused by the battery. Other various embodiments in addition to the disclosed various embodiments in the present invention are possible.

Method for detecting and controlling battery status by using sensor, and electronic device using same

Growing community of inventors

Seoul, South Korea

Seung Eun Lee