Samsung Electro-mechanics Co., Ltd.

Seung-Do An

Jong-Hyeong Song

Sang Kyeong Yun

Anatoliy Lapchuk

Yun-Jin Ko

Victor Yurlov

Je-Hong Kyoung

Yeong-Gyu Lee

Min-Suk Oh

Jae-Wook Jang

Disclosed is a diffractive micromirror and a method of producing the same. More particularly, the present invention pertains to a diffractive thin-film piezoelectric micromirror, which is operated in a piezoelectric operation manner to assure excellent displacement, operation speed, reliability, linearity, and low voltage operation, and a method of producing the same. The diffractive thin-film piezoelectric micromirror includes a silicon substrate on which a recess is formed to provide an air space to the center thereof, and a piezoelectric mirror layer having a band shape, which is attached to the silicon substrate along both ends of the recess at both ends thereof while being spaced from the bottom of the recess at a center portion thereof and which includes a thin-film piezoelectric material layer to be vertically movable when voltage is applied to the piezoelectric material layer, and thus diffracts an incident light beam.

Diffractive thin-film piezoelectric micromirror and method of producing the same

Disclosed are a method for driving a piezoelectric element or an optical modulator including a piezoelectric element and a recorded medium recorded with a program for executing the same. In accordance with an embodiment of the present invention, the method for driving a piezoelectric element causing a displacement object to be displaced by being contracted or expanded according to a supplied driving voltage, including supplying a driving signal to the piezoelectric element during a first driving period in a first voltage range; supplying a control signal for controlling a polarization hysteresis of the piezoelectric element according to a driving, performed during the first driving period, to the piezoelectric element; and supplying the driving signal to the piezoelectric element during a second driving period in a second voltage range.

Method for driving piezoelectric element or optical modulator including piezoelectric element

A spatial optic modulating system with speckle reduction and a method thereof are disclosed. According to an embodiment of the present invention, a spatial optic modulating system includes a spatial optic modulator, which modulates and reflects an image transferred in accordance with an upward or downward movement of a ribbon that is operated according to a contraction or expansion of a piezoelectric element, an image lens unit, which transfers an image modulated from the spatial optic modulator as a diffraction image to a scanner, and a phase modulator, which modulates a phase of the diffraction image transferred from the image lens unit. With the present invention, an image, from which a speckle is removed, can be displayed by modulating a phase of an image projected by using a spatial optic modulator.

Spatial optic modulating system with speckle reduction and method thereof

Disclosed is an optical modulator including: a substrate; an insulation layer disposed on the substrate; a ribbon layer, a center portion of which is spaced apart from the insulation layer by a predetermined gap; a piezoelectric element that is disposed on the ribbon layer and allows the center portion of the ribbon layer to bend vertically; and a passivation layer that is disposed on the piezoelectric element and comprises a main passivation film.

Spatial optical modulator with passivation layer

Disclosed is a diffractive micromirror and a method of producing the same. More particularly, the present invention pertains to a diffractive micromirror, in which a recess having a desired depth and width is precisely formed in a piezoelectric operation manner, and a method of producing the same.

A semiconductor package and packaging method using a flip-chip bonding technology is disclosed. In the semiconductor package and packaging method, the microelement array of a micro-device, for example, the micromirror array of a light modulator having micromirrors that are hyperfine elements, is sealed from the outside using flip-chip bonding technology. Thus, the microelement array is protected from the outside. The packaging method executes the packaging process using only the flip-chip bonding technology, without a wire-bonding technology, at a wafer level instead of a conventional individual semiconductor device level, thus increasing the bonding process efficiency. Furthermore, the electrode array pattern for supplying both electricity and control signals to the microelement array does not pass through a hermetic sealing layer, thus ensuring a well-sealed semiconductor package. The electrode array pattern is also finely formed to correspond to the microelement array which is extremely finely formed.

Growing community of inventors

Kyunggi-do, South Korea

Seung-Do An