Samsung Electronics Co., Ltd.

Lg Display Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Seung Chul Oh

Jong Seok Kim

Jung Hyoung Lee

Hye Cho Shin

Doo Hwan Lee

Kyung Seob Oh

Hyoung Joon Kim

Kyoung Moo Harr

Yoon Suk Cho

Dong San Jun

Jung Gun You

Sug Hyun Sung

Sung Gu Lee

Moon Gyung Kim

Seung Wan Shin

Chan Kyo Park

Ho Jun Jung

There is provided a semiconductor device capable of improving the performance and reliability of a device. The semiconductor device comprising, a first active pattern on a substrate, the first active pattern including a first lower pattern, which extends in a first direction, and first sheet patterns, which are on the first lower pattern, a second active pattern on the substrate, the second active pattern including a second lower pattern, which is spaced apart from the first lower pattern in a second direction and a second sheet patterns, which are on the second lower pattern, wherein the first lower pattern and the second lower pattern is separated by a fin trench.

Semiconductor device

A fan-out semiconductor package includes a frame comprising wiring layers, and a dummy layer, and having a recessed portion on a bottom surface on which a stopper layer is disposed; a semiconductor chip disposed in the recessed portion such that an inactive surface opposes the stopper layer; a first interconnect structure disposed on the connection pad; a second interconnect structure disposed on the outermost wiring layer; a dummy structure disposed on the dummy layer; an encapsulant encapsulating at least portions of the frame, the semiconductor chip, the first interconnect structure, the second interconnect structure, and the dummy structure, and filling at least a portion of the recessed portion; and a connection member disposed on the frame and an active surface of the semiconductor chip, and comprising a redistribution layer electrically connected to first and second metal bumps. The dummy structure has sloped side surfaces.

Fan-out semiconductor package

The present invention relates to a multipurpose assistance lamp which includes: a lighting unit which includes a transparent film and a casing plate which are disposed on a front surface and a back surface of an OLED lighting sheet, respectively; and a back housing which is attached to a back surface of the casing plate, and accommodates therein a circuit part and a battery for operating the OLED lighting sheet, thereby minimizing a thickness and providing light having improved brightness, by adopting an OLED as a light source.

Multipurpose assistance lamp with OLED lighting sheet housing structure

The present invention relates to an OLED standing lamp in which a lighting unit includes a band-shaped transparent film and a band-shaped casing plate, which are disposed on a front surface and a back surface of a band-shaped OLED lighting sheet, respectively, a support body has one end portion at an upper side thereof which is fastened to one end portion of the lighting unit and supports the lighting unit so that the lighting unit is spaced apart from the ground, and a base is extended on the ground and supports the support body fastened to the lighting unit, thereby minimizing a thickness and providing light having improved brightness, by adopting an OLED as a light source.

OLED stand

A fan-out semiconductor package includes a frame having a through hole, a semiconductor chip disposed in the through hole and including connection pads, an encapsulant encapsulating at least a portion of the frame and the semiconductor chip, and a redistribution layer disposed on the frame and the semiconductor chip and including a first region and a second region. In the first region, a first via and a second via, electrically connected to one of the connection pads, disposed in different layers, and connected by a wiring pattern, are disposed. In the second region, a third via and a fourth via, electrically connected to another of the connection pads, disposed in different layers, and connected by the wiring pattern, are disposed. A distance between axes of the first via and the second via is shorter than a distance between axes of the third via and the fourth via.

Disclosed is a multipurpose assistance lamp in which a lighting unit includes a transparent film and a casing plate, which have a curved surface, respectively, and are disposed on a front surface and a back surface of an OLED lighting sheet having a curved surface, a rotary body is coupled to one end portion of the lighting unit so as to support the lighting unit, and a circuit part and a battery for operating the OLED lighting sheet are provided in a base that is hingedly coupled to the rotary body, thereby reducing or minimizing a thickness by adopting an OLED as a light source, and providing light having improved brightness.

Multi-use auxiliary light

A word line driving circuit for use in a semiconductor memory device having a first supply voltage terminal to which a pumping voltage higher than a supply voltage supplied from the exterior of a chip is applied and a second supply voltage terminal to which a ground voltage is applied includes a decoding circuit connected between the first supply voltage terminal and second supply voltage terminal, for receiving a decoded row address, a precharge circuit connected to an output terminal of the decoding circuit, a transfer circuit for receiving an output signal of the decoding circuit and a word line boosting signal, and a word line output circuit connected between the first supply voltage terminal and second supply voltage terminal, for driving a word line.

Growing community of inventors

Seoul, South Korea

Seung Chul Oh