Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Secugraph Inc.

Amkor Technnlogy, Inc.

Seung Chul Han

Dong Hoon Lee

Jung Park

Do Hyung Kim

Il Ju Seo

Jong Sik Paek

Won Chul Do

Doo Hyun Park

Dae Byoung Kang

Young Rae Kim

Pil Je Sung

Seo Yeon Ahn

Jae Kyu Song

Joo Hyun Kim

A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.

Semiconductor package using a coreless signal distribution structure

A semiconductor device with thin redistribution layers is disclosed and may include forming a first redistribution layer on a dummy substrate, electrically coupling a semiconductor die to the first redistribution layer, and forming a first encapsulant layer on the redistribution layer and around the semiconductor die. The dummy substrate may be removed thereby exposing a second surface of the first redistribution layer. A dummy film may be temporarily affixed to the exposed second surface of the redistribution layer and a second encapsulant layer may be formed on the exposed top surface of the semiconductor die, a top surface and side edges of the first encapsulant layer, and side edges of the first redistribution layer. The dummy film may be removed to again expose the second surface of the first redistribution layer, and a second redistribution layer may be formed on the first redistribution layer and on the second encapsulant layer.

Semiconductor device with thin redistribution layers

A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise connection verification for a first one or more mounted components prior to additional assembly.

Semiconductor device and manufacturing method thereof

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Growing community of inventors

Uijeongbu-si, South Korea

Seung Chul Han