Samsung Electronics Co., Ltd.

Seung-Bae Pyon

Soo-Hyung Kim

Young-Min Kang

Young-Tack Cho

An ESD structure in an LCD module mounting structure in a terminal for mounting an LCD module on the inner surface of a case frame to be exposed through an opening of a predetermined size formed on the case frame. In the ESD structure, an EMI shielding is formed to be electrically connected to a main board of the terminal and grounded by coating EMI spray all over the inner surface of the case frame including a part of an overlap between the inner surface of the case frame and the LCD module. At least one through hole penetrates from the inner surface to the outer surface of the case frame at an appropriate portion of the overlap. Conductive means electrically connects the inner surface of the through hole to the EMI shielding. Therefore, externally introduced static electricity is actively grounded inside the terminal along the through hole.

Growing community of inventors

Suwon-si, South Korea

Seung-Bae Pyon