Osong Medical Innovation Foundation

Seung-A Lee

Ha-Chul Jung

Jin-Woo Ahn

Jin-Won Kim

In-Ho Song

Ha Na Park

Dong-Jun Moon

Young-Jin Kim

Sung-Keun Yoo

Sang-Hun Lee

Jin-Hee Moon

In a thin film electrode separation method using thermal expansion coefficient, a first solution is coated on a substrate. The first solution coated on the substrate is hardened. The substrate is left in a predetermined time, to form a first thin film having a first thermal expansion coefficient on the substrate. A photoresist is coated on the substrate having the thin film formed thereon. The photoresist coated on the substrate is hardened, to form a photoresist film having a second thermal expansion coefficient. A metal and a passivation layer are formed on the photoresist film. The photoresist film is detached from the first thin film, using difference of a thermal expansion coefficient between the photoresist film and the first thin film.

Thin film electrode separation method using thermal expansion coefficient

A method of manufacturing a feedthrough having an enhanced hermetic sealing and used for a human implantable medical device such as a deep brain stimulator, a implantable AED, a implantable spinal cord stimulator and so on. Thus, more enhanced reproducibility and productivity in the diffusion welding and the laser hole machining may be guaranteed in the present method of manufacturing the feedthrough, compared to the conventional method using the ceramic metallizing and the brazing.

Method of manufacturing feedthrough

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Seoul, South Korea

Seung-A Lee