Samsung Electronics Co., Ltd.

Seul-Ki Han

Chang-Ho Lee

Min-Woo Kim

Yong-Dae Ha

Du-San Baek

Young-Shin Choi

Myoun-Kyu Kang

Ki-Bong Mun

An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.

Apparatus for combining printed circuit boards

Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.

Pipe structure and semiconductor module testing equipment including the same

Growing community of inventors

Asan-si, South Korea

Seul-Ki Han