Fuji Polymer Industries Co., Ltd.

National Institute of Advanced Industrial Science and Technology

Setsuo Kikuchi

Takumi Kataishi

Makoto Iwai

Yuji Hotta

Yusuke Imai

Mai Sugie

Yuko Kimura

Yuichi Tominaga

Yoshiki Sugimoto

A thermally conductive silicone gel composition of the present invention includes the following A to F: (A) an organopolysiloxane having two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having two Si—H groups per molecule; (C) an organohydrogenpolysiloxane having three or more Si—H groups per molecule; (D) at least one compound selected from the group consisting of D1 and D2: (D1) an organopolysiloxane having one alkenyl group per molecule and (D2) an organohydrogenpolysiloxane having one Si—H group per molecule; (E) a platinum catalyst; and (F) a thermally conductive filler in an amount of 100 to 600 vol % with respect to 100 vol % of the total amount of the A to E. The components A to F are cured. With this configuration, the thermally conductive silicone gel composition can reduce oil bleeding, even though the composition is a gel cured product.

Thermally conductive silicone gel composition

Composite resin granulescontain a binder resinand a thermally conductive filler. The thermally conductive filler includes a non-anisotropic thermally conductive fillerand an anisotropic thermally conductive filler. The composite resin granules containing the binder resin and the thermally conductive filler are formed into a spherical shape. The particles of the anisotropic thermally conductive fillerare oriented in random directions. A thermally conductive rein molded bodyof the present invention is obtained by compressing the composite resin granules. Thus, the present invention provides the thermally conductive resin molded body that has relatively high thermal conductivities in the in-plane direction and the thickness direction, well-balanced directional properties of thermal conduction, and a low specific gravity, the composite resin granules suitable for the thermally conductive resin molded body, and methods for producing them.

Composite resin granules and method for producing the same, and thermally conductive resin molded body using composite resin granules and method for producing thermally conductive resin molded body

A heat conductive sheet of the present invention is a heat conductive sheet containing a curing reaction catalyst, wherein a heat conductive uncured compositionnot containing a curing reaction catalyst is joined to at least one principal surface of the heat conductive sheetcontaining a curing reaction catalyst. The heat conductive sheetcontaining a curing reaction catalyst contains the curing reaction catalyst in an amount necessary to cure the heat conductive uncured composition. A mounting method of the present invention includes: joining a heat conductive uncured compositionnot containing a curing reaction catalyst to at least one principal surface of the heat conductive sheetcontaining a curing reaction catalyst, and curing the heat conductive uncured composition by diffusion of the curing reaction catalyst contained in the heat conductive sheet. Thereby, the heat conductive uncured composition can be joined to the heat conductive sheet immediately before mounting to an electronic component or the like, easily follow the unevenness of a heat generating part and/or heat dissipating part, and cure after mounting.

Heat-conductive sheet, mounting method using same and bonding method using same

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Aichi, Japan

Setsuo Kikuchi