Chisso Corporation

Jnc Corporation

Setsuo Itami

Hiroyuki Satou

Toshiyuki Takahashi

Kouichi Kunimune

Kazutsune Kikuta

Takayuki Hattori

Katsuyuki Sugihara

Yosihiro Deyama

Fumitaka Ooizumi

Shinta Morokoshi

Atsushi Murotani

Yoshihiro Deyama

Takayuki Hirota

Yoshihiro Soeda

Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.

Thermosetting resin composition, cured film, substrate with cured film, and electronic component

An ink-jet ink is provided. The ink-jet ink includes a compound of formula (1) to form a cured film with high-flame retardancy. In the formula, R is hydrogen, hydroxyl, or an organic group of 1 to 100 carbon atoms; and n is an integer of 1 to 20: 

Ink-jet ink

The invention relates to a method for manufacturing an inkjet ink including a polyamic acid (A), including a step of at least reacting one or more compounds selected from the group of a monoamine (a3) and a compound having one acid anhydride group (a4) with a compound having two or more acid anhydride groups (a1) and a diamine (a2).

Inkjet ink

A UV-curable ink-jet ink is provided, which has a high sensitivity and allows soft and highly fine patterns to be formed. The UV-curable ink-jet ink includes a mono-functional polymerizable monomer (A) having a hydroxyl group, a di(meth)acrylate ester (B) and a photo-polymerization initiator (C).

UV-curable ink-jet ink, electronic circuit board, electronic component and display device

A silicon-modified, adhesive polyimide film composed mainly of the repetition units of the formula (I) and a process for producing a polyimide film composite product using the above film are provided, the formula (I) being ##STR1## the above process for producing a polyimide film composite product comprising subjecting the above-silicon-modified polyimide film to contact-bonding on heating to a material to be adhered, at an ultimate curing temperature of 130.degree.-230.degree. C. The above polyimide film is highly adhesive and heat-resistant in spite of heating at a relatively low temperature.

Adhesive polyimide film

Growing community of inventors

Ichihara, Japan

Setsuo Itami