Matsushita Electric Industrial Co., Ltd.

Setsuo Horimoto

Satoshi Masuda

Yoshihiko Misawa

Keiji Saeki

Makoto Kawai

Koichi Morita

Koichi Kanematsu

Naomi Nishi

Hideki Yoshihara

Yoshifumi Nakao

Kenichi Satou

When a semiconductor chip is mounted on a wiring substrate, an end of a metallic wire fed through a capillary is first fused to form a ball, which is in turn pressed against and bonded to an electrode pad formed on a semiconductor chip. The metallic wire is then cut at a location in the proximity of the ball so that a portion of the metallic wire remains as a protruding contact on the ball. The protruding contact is pressed against a shaping platform coated with a paste-like electrically-conductive adhesive film to thereby cause the protruding contact to have a given height and transfer a portion of the adhesive film to the protruding contact. The protruding contact is eventually bonded to an electrically-conductive film formed on the wiring substrate via the transferred portion of the adhesive film.

Method of mounting a semiconductor chip on a wiring substrate

An assembly line includes a printing device for printing solder on a land of a circuit board, a mounting device for mounting an electric component at a predetermined position of the solder, and a soldering device for soldering the land to a terminal of the component. A monitored items detecting device detects predetermined to be monitored items of the board and equipment used in the printing, mounting, or soldering devices, and a control device analyzes a condition of the equipment and quality of the board with reference to warning criterion which do not exceed failure criterion, and then dynamically controls the various devices accordingly.

Producing system of printed circuit board and method therefor

A component mounting apparatus includes a holding section for holding a plurality of component mounting heads, each head having a component sucking nozzle. One of the component mounting heads selectively held by the holding section can be mounted on a component mounting section. A storage section, provided on each component mounting head, stores information of each component mounting head, and a reading section, provided on the component mounting section, reads the information of the storage section.

Component mounting apparatus

Growing community of inventors

Katano, Japan

Setsuo Horimoto