Mitsui Chemicals, Inc.

Setsuko Oike

Yugo Yamamoto

Akinori Etoh

Tomokazu Ishizuka

Shigeharu Fujii

Kiyotaka Shindo

Masatoshi Takagi

Eiji Hayashishita

Mitsuru Sakai

Jun Okabe

Katsutoshi Ozaki

The purpose of the present invention is to provide the following: an optical-device surface-sealing composition that makes it possible to fabricate an optical-device-using display with a low amount of warpage even if there is a large difference between the coefficients of linear expansion of substrates used in said display; a display with a low amount of warpage; and a manufacturing method therefor. The storage modulus of elasticity (G'(80)) of this optical-device surface-sealing composition, measured at 80&#xb0; C. after said composition is heated from 40&#xb0; C. to 80&#xb0; C. at 5&#xb0; C./min and then held at 80&#xb0; C. for 30 minutes, is between 1.0&#xd7;10and 2.0&#xd7;10Pa.

Optical-device surface-sealing composition, optical-device surface-sealing sheet, display, and display manufacturing method

To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N&#x2014;H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa&#xb7;s, as measured by E-type viscometer at 25&#xb0; C. and 1.0 rpm.

Surface sealant for optical semiconductor, method for manufacturing organic EL device, organic EL device and organic EL display panel using the same

To provide an olefinic expandable substrate and a dicing film that exhibits less contamination characteristics, high expandability without necking, which cannot be achieved by conventional olefinic expandable substrates. In order to achieve the object, an expandable film comprises a 1-butene-&#x3b1;-olefin copolymer (A) having a tensile modulus at 23&#xb0; C. of 100 to 500 MPa and a propylenic elastomer composition (B) comprising a propylene-&#x3b1;-olefin copolymer (b1) and having a tensile modulus at 23&#xb0; C. of 10 to 50 MPa, wherein the amount of the component (B) is 30 to 70 weight parts relative to 100 weight parts in total of components (A) and (B).

Expandable film, dicing film, and method of producing semiconductor device

Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B).

Polishing slurry and polishing material using same

Disclosed is a polishing composition containing not less than 1 wt % of a water-soluble resin, which is obtained by polymerizing a vinyl monomer containing an amino group and/or an amide group, based on the total weight of the polishing composition.

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Yokohama, Japan

Setsuko Oike