Oracle International Corporation

Intersil Americas Inc.

Maxim Integrated Products, Inc.

Soraa, Inc.

Seshasayee S Ankireddi

Lynn Karl Wiese

David W Copeland

Frank Michael Steranka

Jerome Chandra Bhat

Troy A Trottier

Rafael Ignacio Aldaz

Kumar Nagarajan

Vadim Gektin

Seshasayee Gaddamraja

Ken Wang

Tian Tian

Kumar Nagaranjan

Rohit Modi

Rajarshi Saha

An optical package containing optical sensor/detector pairs co-housed with a non-optical sensor and processes for fabricating the optical package are described herein. Traditional package structures require the use of clear mold compounds to protect the sensitive dies, but such compounds degrade with time and temperature. The optical package described herein uses a special glass top cover that is transparent in the entire electro-magnetic spectral region required by the contained dies.

Structure and method for hybrid optical package with glass top cover

Techniques for fabricating and using arrays of violet-emitting LEDs coated with densely-packed-luminescent-material layers together with apparatus and method embodiments thereto are disclosed.

Dense-luminescent-materials-coated violet LEDs

A sensor-in-package device, a process for fabricating a hermetically-sealed sensor-in-package device, and a process for fabricating a hermetically-sealed sensor-in-package device with a pre-assembled hat that employ example techniques in accordance with the present disclosure are described herein. In an implementation, the sensor-in-package device includes a substrate; at least one thermopile, at least one photodetector, at least one light-emitting diode, an ultraviolet light sensor, and a pre-assembled hat disposed on the first side of the substrate, where the pre-assembled hat includes a body; a first lid; and a second lid; where the body, the substrate, and the first lid define a thermopile cavity that houses the at least one thermopile, and where the body, the substrate, and the second lid define an optical cavity that houses at least one of the at least one photodetector, the at least one light-emitting diode, or the ultraviolet light sensor.

Hermetic solution for thermal and optical sensor-in-package

An apparatus for cooling an integrated circuit (IC) die is described. The apparatus includes an adhesion layer coated on a surface of the IC die, wherein the adhesion layer has high thermal conductivity. The apparatus also includes a heat dissipation structure affixed onto the adhesion layer. This heat dissipation structure further includes a set of discrete heat dissipation elements which are substantially mechanically isolated from each other. This set of discrete heat dissipation elements provides an extended heat dissipation surface for the IC die. Moreover, each of the set of discrete heat dissipation elements has high compliance, which allows the adhesion layer to be sufficiently thin, thereby reducing a thermal conductivity of the adhesion layer.

Heat dissipation structure for an integrated circuit (IC) chip

An optoelectronic apparatus includes one or more packaged optoelectronic semiconductor devices (POSDs), each including one or more optoelectronic elements encapsulated by a light transmissive molding compound. Each POSD includes a top surface formed by a top surface of the light transmissive molding compound that encapsulates the one or more optoelectronic elements of the POSD. Each POSD also includes a bottom surface including electrical contacts for the one or more optoelectronic elements of the POSD. A peripheral surface extends between the top and bottom surfaces. A light reflective molding compound surrounds the peripheral surface of each POSD and forms a reflector cup for each POSD. The electrical contacts on the bottom surface of each POSD are exposed, and thus, are accessible for electrical connections to other circuitry. Where the optoelectronic apparatus includes a plurality of POSDs, the light reflective molding compound also connects neighboring POSDs to one another.

Optoelectronic apparatuses with post-molded reflector cups

A method for manufacturing a plurality of optoelectronic apparatuses include attaching bottom surfaces of a plurality of packaged optoelectronic semiconductor devices (POSDs) to a carrier substrate (e.g., a tape) so that there is a space between each POSD and its one or more neighboring POSD(s). A light reflective molding compound is molded around a portion each of the POSDs attached to the carrier substrate so that a reflector cup is formed from the light reflective molding compound for each of the POSDs. The light reflective molding compound can also attach the POSDs to one another. Alternatively, an opaque molding compound can be molded around each POSD/reflector cup to attach the POSDs/reflector cups to one another and form a light barrier between each POSD and its neighboring POSD(s). The carrier substrate is thereafter removed so that electrical contacts on the bottom surfaces of the POSDs are exposed.

Optoelectronic apparatuses with post-molded reflector cups and methods for manufacturing the same

A method for manufacturing an optoelectronic apparatus includes attaching bottom surfaces of first and second packaged optoelectronic semiconductor devices (POSDs) to a carrier substrate (e.g., a tape) so that there is a space between the first and second POSDs. An opaque molding compound is molded around portions of the first and second POSDs attached to the carrier substrate, so that peripheral surfaces of the first POSD and the second POSD are surrounded by the opaque molding compound, the space between the first and second POSDs is filled with the opaque molding compound, and the first and second POSDs are attached to one another by the opaque molding compound. The carrier substrate is thereafter removed so that electrical contacts on the bottom surfaces of the first and second POSDs are exposed. A window for each of the POSDs is formed during the molding process or thereafter.

Optoelectronic apparatuses and methods for manufacturing optoelectronic apparatuses

A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board.

Growing community of inventors

San Jose, CA, United States of America

Seshasayee S Ankireddi