Cornell University

Honeywell International Inc.

Cornell Research Foundation Inc.

Serhan Mehmet Ardanuc

Amit Lal

Justin C Kuo

Jason T Hoople

Thomas Schenkel

Yue Shi

Qing Ji

Arun Persaud

Farhan Rana

Peter Seidl

Will Waldron

Vinaya Kumar Kadayra Basavarajappa

June-Ho Hwang

Steven J Eickhoff

Steven Tin

Christopher Kemper Ober

Jeffrey James Kriz

Jeff A Ridley

Shankar Radhakrishnan

Ved Gund

Sachin Nadig

Norimasa Yoshimizu

Alex Ruyack

Katherine Camera

Techniques, systems, and devices are described for implementing for implementing computation devices and artificial neurons based on nanoelectromechanical (NEMS) systems. In one aspect, a nanoelectromechanical system (NEMS) based computing element includes: a substrate; two electrodes configured as a first beam structure and a second beam structure positioned in close proximity with each other without contact, wherein the first beam structure is fixed to the substrate and the second beam structure is attached to the substrate while being free to bend under electrostatic force. The first beam structure is kept at a constant voltage while the other voltage varies based on an input signal applied to the NEMS based computing element.

Computation devices and artificial neurons based on nanoelectromechanical systems

A SAW-based inertial sensor incorporates a curved SAW drive resonator and graphene electrodes to increase the Coriolis force on a pillar array and generate secondary SAW waves that create a strain-induced hyperfine frequency transition in an enclosed alkali atom vapor, in conjunction with an integrated FP resonator to measure very small inertial signals corresponding to 10 &#x3bc;g and 0.01&#xb0;/hr, representing a dynamic range of 10 orders of magnitude.

Surface acoustic wave (SAW)-based inertial sensor, methods, and applications

A wafer-based charged particle accelerator includes a charged particle source and at least one RF charged particle accelerator wafer sub-assembly and a power supply coupled to the at least one RF charged particle accelerator wafer sub-assembly. The wafer-based charged particle accelerator may further include a beam current-sensor. The wafer-based charged particle accelerator may further include at least a second RF charged particle accelerator wafer sub-assembly and at least one ESQ charged particle focusing wafer. Fabrication methods are disclosed for RF charged particle accelerator wafer sub-assemblies, ESQ charged particle focusing wafers, and the wafer-based charged particle accelerator.

Wafer-based charged particle accelerator, wafer components, methods, and applications

Methods, structures, devices and systems are disclosed for solarizing soil using a moveable optical focusing array. In one example, an apparatus to solarize soil from a moveable platform includes a vehicle, an array of mirrors located on the exterior of the vehicle, in which the mirrors are steerable to control the orientation of the mirrors to direct sunlight to a spot on soil that generates heat to a solarize the soil, and a sensor coupled to the vehicle to measure the temperature of the soil, in which the orientation of the mirrors is determined based at least in part on the measured temperature to control the temperature of the soil.

Solar-concentrating solarization apparatus, methods, and applications

A system that generates short charged particle packets or pulses (e.g., electron packets) without requiring a fast-switching-laser source is described. This system may include a charged particle source that produces a stream of continuous charged particles to propagate along a charged particle path. The system also includes a charged particle deflector positioned in the charged particle path to deflect the stream of continuous charged particles to a set of directions different from the charged particle path. The system additionally includes a series of beam blockers located downstream from the charged particle deflector and spaced from one another in a linear configuration as a beam-blocker grating. This beam-blocker grating can interact with the deflected stream of charged particles and divide the stream of the charged particles into a set of short particle packets. In one embodiment, the charged particles are electrons. The beam blockers can be conductors.

Generation and acceleration of charged particles using compact devices and systems

A monolithic, bulk piezoelectric actuator includes a bulk piezoelectric substrate having a starting top surface and an opposing starting bottom surface and a at least two electrodes operatively disposed on the bulk piezoelectric substrate consisting of at least two discrete electrodes disposed on either/both of the starting top surface and the starting bottom surface and at least one electrode disposed on the respective other starting bottom surface or starting top surface. A stage includes a base, at least two of the monolithic, bulk piezoelectric actuators disposed on the base, a movable platform disposed on the base, and a respective number of deformable connectors each having a first connection to a respective one of the piezoelectric actuators and a second connection to a respective portion of the movable platform. A method for monolithically making a monolithic, bulk piezoelectric actuator involves a direct write micropatterning technique.

Monolithic PZT actuator, stage, and method for making

Embodiments herein provide for a self-destructing chip including at least a first die and a second die. The first die includes an electronic circuit, and the second die is composed of one or more polymers that disintegrates at a first temperature. The second die defines a plurality of chambers, wherein a first subset of the chambers contain a material that reacts with oxygen in an exothermic manner. A second subset of the chambers contain an etchant to etch materials of the first die. In response to a trigger event, the electronic circuit is configured to expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature, and is configured to release the etchant from the second subset of the chambers to etch the first die.

Self-destructing chip

A systemfor reflecting or redirecting incident light, microwave or sound energy includes a first substrateconfigured to support an array of reflective elementsthat can be angularly displaced through a range of substantially 90 degrees in response to a reflector angle control signal and a controller programmed to generate the reflector angle control signal to achieve desired incident energy beam or wavefront re-direction. The reflective elementspreferably comprise MEMS micro-reflector elements hingedly or movably attached to the first substrateand define a reflective surface that is aimed at the source of incident light, microwave or sound energy.

Multi-axis, large tilt angle, wafer level micromirror array for large scale beam steering applications

A solid-state semiconductor device operable without loss arising from junction-to junction (e.g., source-to-drain) leakage current includes a movable MEMS switch or relay armature structure carrying at least one electrical contact corresponding to a semiconductor device junction. The switch or relay armature is movable from a first position corresponding to a first switch state to a second position corresponding to a second switch state. The semiconductor device also includes an actuation circuit configured to act on the cantilever switch, changing the switch from a first contact-conducting state to a second non-contact-conducting state by physically separating the switch's electrical contact from the semiconductor device junction, thus eliminating the conductive path for leakage current losses.

Relay-connected semiconductor transistors

Growing community of inventors

Ithaca, NY, United States of America

Serhan Mehmet Ardanuc