Corning Incorporated

Corning Research & Development Corporation

Sergio Tsuda

Garrett Andrew Piech

Robert Stephen Wagner

Sasha Marjanovic

Albert Roth Nieber

Dana Craig Bookbinder

Pushkar Tandon

Stephan Lvovich Logunov

Sinue Gomez

Lisa Anne Moore

Helmut Schillinger

Shyamala Shanmugam

Ivan A Cornejo

Natesan Venkataraman

Kamjula Pattabhirami Reddy

Carlos Alberto Pons Siepermann

Zsigmond Varga

James Joseph Price

James Andrew West

Anatoli Anatolyevich Abramov

Alranzo Boh Ruffin

Johannes Moll

Ravindra Kumar Akarapu

James Joseph Watkins

Alexander Mikhailovich Streltsov

Melinda Ann Drake

Raymond Miller Karam

Davide Domenico Fortusini

Yanming Liu

Lewis Kirk Klingensmith

Gregory Scott Glaesemann

David Andrew Pastel

Michael Henry Wasilewski

Lars Martin Otfried Brusberg

Michael Albert Joseph, Ii

Kristopher Allen Wieland

Jose Mario Quintal

Jann Paul Kaminski

Matthew Lee Black

Christopher Paul Daigler

Uwe Stute

Yongqian Liu

Ming Ying

John Charles Speeckaert

Chad Michael Wilcox

Jonas Bankaitis

James Micheal Harris

Michael Vasilyev

ChuanChe Wang

Thomas Hackert

Neil Eugene Partridge

Andreas Simon Gaab

Jonathan Earl Walter

Heather Nicole Vanselous

Christina Marie Laskowski

Scott Steven Cronk

Brian Nilsen

Gregory G Luther

Duc Anh Bui

Jason Roy Grenier

Marie Bernadette O'Regan

Hasan Fiaz

Andrea Nichole Yeary

Valeria L DaSilva

Alan J Lucero

Karin M Ennser

Carlos Pons Siepermann

Carlos A Pons Siepermann

Jonathan E Walter

Processes and devices by which a brittle material substrate may be edge formed and finished to simultaneously remove corresponding damage remaining on the edges in the areas formed by cutting and separation while imposing a desired edge profile and achieving a desired mechanical edge strength. Processes of the present disclosure may include a chemical and mechanical brush polishing process configured to shape and/or polish a surface of one or more thin substrates. A plurality of substrates may be arranged in a stacked configuration, and engineered interposer devices may be arranged between the stacked substrates. The interposers may provide between the substrates and may direct filament placement during brushing so as to guide material removal on the substrate edges. Substrate edge profile shapes, including symmetric and asymmetric profiles, may be formed by strategic manipulation of interposer properties including dimensions, mechanical features, material properties, and positioning.

Method and apparatus for edge finishing of high mechanical strength thin glass substrates

A method of separating a transparent workpiece comprises depositing a sacrificial layer onto a textured surface of the transparent workpiece, the sacrificial layer comprising a refractive index that is less than or equal to a refractive index of the transparent workpiece and greater than or equal to a refractive index of air. A defect-forming laser beam is generated via an optical assembly and used to form a plurality of defects in the transparent workpiece through sacrificial layer. The defect forming laser beam either comprises a pulsed laser beam forming a laser beam focal line in the transparent workpiece or an optical power of greater than or equal a critical power level to induce Kerr effect self-focusing in the transparent workpiece. The transparent workpiece is separated along the contour.

Sacrificial layers to enable laser cutting of textured substrates

A method of separating a portion of an object comprising: presenting an object having a thickness; using a laser emission at a wavelength to perforate at least a portion of the thickness of the object sequentially over a length to form a series of perforations between a first portion of the object on one side of the series of perforations and a second portion of the object on the other side of the series of perforations; and applying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object, wherein the thickness of the object, at the series of perforations, is transparent to the wavelength of the laser emission.

Method of separating a liquid lens from an array of liquid lenses

A method of separating a transparent mother sheet includes contacting a first surface of the transparent mother sheet with an open ended pressure assembly including a pressure vessel shell, thereby forming a shell cavity defined by the first surface of the transparent mother sheet and the pressure vessel shell, where the transparent mother sheet comprises a damage path. The method also includes removing gas from the shell cavity through a fluid removal outlet extending through the pressure vessel shell to reduce a cavity pressure in the shell cavity, thereby applying stress to the damage path to separate a portion of the transparent mother sheet along the damage path.

Methods for separating transparent articles from a transparent mother sheet using an open ended pressure assembly

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Method for rapid laser drilling of holes in glass and products made therefrom

A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength &#x3bb;, an effective spot size w, and a non-axisymmetric beam cross section having a minimum Rayleigh range Zin an x-direction and a minimum Rayleigh range Zin a y-direction. Further, the smaller of Zand Zis greater than where Fis a dimensionless divergence factor comprising a value of 10 or greater.

Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots

The methods of singulating an optical waveguide sheet that supports sheet optical waveguides include irradiating the optical waveguide sheet with a focused laser beam comprising ultrafast light pulses to form within the body of the optical waveguide sheet modified regions, which along with unmodified regions, that define a singulation line. The modified regions define modified sections that are spaced apart by the unmodified sections, which reside at locations of the sheet optical waveguides. The optical waveguide sheet is separated along the singulation line to form an optical waveguide substrate with substrate waveguides formed by sections of the sheet optical waveguides. The optical waveguide substrate has an end face with both smooth and rough sections. The substrate waveguides have end surfaces that terminate at the smooth sections, thereby enabling low-loss optical coupling to other optical components.

Methods of singulating optical waveguide sheets to form optical waveguide substrates

Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.

Strengthened glass articles having etched features and methods of forming the same

The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a COlaser (coupled with high pressure air flow) for fully automated separation.

Laser cut composite glass article and method of cutting

The embodiments disclosed herein relate to methods, systems, and system components for creating and arranging small (micron and smaller) defects or perforations in transparent materials in a particular manner, and, more particularly, to the arrangement of these defects, each of which has an average crack length, in a predetermined spaced-apart relation (each defect separated from an adjacent defect by a predetermined distance) defining a contour in a transparent material to lower the relative interface fracture toughness for subsequent planned induced separation.

Method and system for forming perforations

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.

Edge chamfering methods

Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a COlaser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or COlasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.

Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla&#xae; glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a COlaser for fully automated separation.

Processing 3D shaped transparent brittle substrate

A method of arresting propagation of an incident crack through a transparent material includes focusing pulsed laser beams into a laser beam focal line directed into the transparent material a series of locations corresponding to a predetermined pattern that is designed to arrest an incident crack that propagates through the transparent material, and generating, with the laser beam focal line (), an induced absorption within the transparent material in order to produce a defect () in the transparent material.

Method and system for arresting crack propagation

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Horseheads, NY, United States of America

Sergio Tsuda