Max-planck-gesellschaft Zur F&#xf6;rderung Der Wissenschaften E. V.

UniversitÄt De Barcelona

Sergio Gómez Fernández

David Gascon Fora

Masahiro Teshima

Razmik Mirzoyan

Joan Mauricio Ferré

Andreu Sanuy Charles

A semiconductor photomultiplier module () comprises a first semiconductor chip () disposed in a first plane and comprising an array () of single-photon avalanche diodes (SPAD), a second semiconductor chip () disposed in a second plane and comprising a first part of an electronic read-out circuit, and a third semiconductor chip () comprising a second part of the electronic read-out circuit, wherein the first semiconductor chip () and the second semiconductor chip () are arranged in a stacked relationship and vertical electrical interconnects () are arranged to electrically interconnect the first semiconductor chip () with the second semiconductor chip ().

Semiconductor photomultiplier module comprising a stacked configuration of a sensor chip and electronic readout chips

A summation circuit () for summing one or more signals received from a photomultiplier array is proposed. The summation circuit comprises one or more readout circuits () coupleable to one or more photodiodes of the photomultiplier array (), respectively, and a channel summing module (), coupled at one or more outputs of the one or more readout circuits, respectively, to sum the one or more signals provided by the one or more readout circuits. The one or more readout circuits are coupleable to the photodiode of the photomultiplier array. Each readout circuit () comprises one or more coefficient controllers (C, C) for controlling multiplying coefficients of the received signal. The coefficient controllers may be placed at the input and/or at the output of the readout circuits ().

Summation for multi-channel photomultiplier array signals

Growing community of inventors

Barcelona, Spain

Sergio Gómez Fernández