Hewlett Packard Enterprise Development LP

Sergio Escobar-Vargas

Niru Kumari

Cullen Edwin Bash

Tahir Cader

John P Franz

Siamak Tavallaei

David Allen Moore

Sarah Anthony

An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.

Substrate sprayer

A device comprises a first layer of a die. The first layer comprises a microchannel. The microchannel is partially filled with a liquid and partially filled with air. The die also comprises a second layer. The second layer of the die seals a top of the microchannel of the first layer.

Fluid-filled microchannels

According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.

Electronic apparatus having a cooling apparatus

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Palo Alto, CA, United States of America

Sergio Escobar-Vargas