Kla Tencor Corporation

Sergio Edelstein

Carl Hess

Zain Saidin

Christophe Fouquet

Savitha Nanjangud

Various systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof are provided. One system is configured to detect design defects and process defects at locations on a wafer at which images are acquired by an electron beam review subsystem based on defects in a design, additional defects in the design, which are detected by comparing an image of a die in the design printed on the wafer acquired by the electron beam review subsystem to an image of the die stored in a database, and defects detected on the wafer by a wafer inspection system.

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Boston, MA, United States of America

Sergio Edelstein