Duke University

Cadence Design Systems, Inc.

Imec

Imec Vzw

Sergej Deutsch

Krishnendu Chakrabarty

Erik Jan Marinissen

Embedded processor-based self-test and diagnosis using the compressed test data is described for ICs having on-chip memory. Techniques for compressing the test data before the compressed test data is transferred to a device under test (DUT) are also described. A modified LZ77 algorithm can be used to compress strings of test data in which don't care bits are handled by assigning a value to the don't care bits according to a longest match in the window as the data is being encoded. The compressed test data can be decompressed at the DUT using a software program transferred by the automated test equipment (ATE) to the DUT with the compressed test data. Decompression and diagnostics can be carried out at the DUT using an embedded processor and the on-chip memory. Results from the diagnostics can be read by the ATE.

Software-based self-test and diagnosis using on-chip memory

A post-fabrication debug and on-line error checking framework for 2D- and 3D-ICs with integrated memories is described. A design-for-debug (DfD) architecture can include, for an IC with on-chip memory, a debug module connected to a functional bus of the IC. The debug module receives trace data for an interval, generates compact signatures based on the received data, and compares these signatures to expected signatures. Intervals containing erroneous trace data can be identified by the debug module and stored in on-chip memory. A single iteration of signal tracing for debug testing between automated test equipment and the IC is possible.

Signal tracing using on-chip memory for in-system post-fabrication debug

A design for test (DfT) architecture is provided that enables pre-bond parametric testing of through-silicon vias (TSVs). A grouping of N number of input/output (I/O) segments are configured to receive a test signal in a feedback loop, where each I/O segment includes one or more buffers (or inverters) and a TSV connected at one end to the one or more buffers. The TSV acts as a shunt-connected capacitor&#x2014;when defect free&#x2014;and includes a load resistance when the TSV contains a defect. Each I/O segment can also include one or two multiplexers to control whether the I/O segment receives a test or functional signal and, optionally, whether the I/O segment is bypassed or included in the ring oscillator. The varying loads caused by the defects cause variations in the delay across the buffers (or inverters) of an I/O segment that can be detected in the output signal.

Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels

A method is provided to test a modular integrated circuit (IC) comprising: testing a module-under-test (MUT) within the IC while causing a controlled toggle rate within a first neighbor module of the MUT; wherein the controlled toggle rate within the first neighbor module is selected so that toggling within the first neighbor module has substantially the same effect upon operation of the MUT that operation of the first neighbor module would have during actual normal functional operation of the first neighbor module.

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Durham, NC, United States of America

Sergej Deutsch