Samsung Electronics Co., Ltd.

Seran Bae

Mi-Na Choi

Jae Choon Kim

Kyoungsei Choi

Yunhyeok Im

Eunseok Cho

Heejung Hwang

In a package-on-package (PoP) device according to the inventive concepts, an anisotropic conductive film is disposed between a lower semiconductor package and an upper semiconductor package to remove an air gap between the lower and upper semiconductor packages. Thus, heat generated from a lower semiconductor chip may be rapidly and smoothly transmitted toward the upper semiconductor package, thereby increasing or maximizing a heat exhaust effect of the PoP device.

Package-on-package devices, methods of fabricating the same, and semiconductor packages

An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.

Semiconductor devices and methods of controlling temperature thereof

Growing community of inventors

Yongin-si, South Korea

Seran Bae