Utac Hong Kong Limited

Utac Headquarters Pte. Ltd.

A-Sat Corporation

Advanced Technology Interconnect Incorporated

Utac Dongguan Ltd.

Serafin Padilla Pedron, Jr

Kirk Powell

John McMillan

Adonis Fung

Nathapong Suthiwongsunthorn

John Ducyao Beleran

Saravuth Sirinorakul

German J Ramirez

Albert Loh

Edward Then

Semiconductor packages and methods for forming a semiconductor package are presented. The semiconductor package includes a package substrate having a die region on a first surface thereof. The package includes a die having a sensing element. The die is disposed in the die region and is electrically coupled to contact pads disposed on the first surface of the package substrate by insulated wire bonds. A cap is disposed over the first surface of the package substrate. The cap and the first surface of the package substrate define an inner cavity which accommodates the die and the insulated wire bonds. The insulated wire bonds are directly exposed to an environment through at least one access port of the package.

Semiconductor packages and methods for forming semiconductor package

A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.

Leadless integrated circuit package having standoff contacts and die attach pad

Embodiments of the present invention are directed to a thermal leadless array package with die attach pad locking feature and methods of producing the same. A copper layer is half-etched on both surfaces to define an array of package contacts and a die attach pad. Each die attach pad is fully embedded in encapsulate material to provide a positive mechanical locking feature for better reliability. In some embodiments, the contacts include four active corner contacts.

Thermal leadless array package with die attach pad locking feature

A leadless integrated circuit (IC) package comprising an IC chip mounted to a die-attach area and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die-attach area are all covered with a molding material, with portions of the electrical contacts and die-attach area protruding from a bottom surface of the molding material.

Leadless array plastic package with various IC packaging configurations

An integrated circuit package includes a substrate having conductive traces therein. A first semiconductor die is mounted in a die-down configuration to a first surface of the substrate. A second semiconductor die is mounted to a backside of the first semiconductor die. A plurality of connectors electrically connect the first semiconductor die to portions of the conductive traces of the substrate and a plurality of wire bonds connect the second semiconductor die to other portions of the conductive traces of the substrate. An encapsulant encapsulates the wire bonds and covers at least a portion of the first surface of the substrate and the second semiconductor die. A ball grid array is disposed on a second surface of the substrate, bumps of the ball grid array being connected with the conductive traces.

Stacked semiconductor package and method of manufacturing the same

A semiconductor package comprising: (a) at least one semiconductor device; (b) a metal heat spreader that has at least one surface exposed to ambient and the perimeter of that exposed surface having a seal ring border; (c) a leadframe having a plurality of inner and outer leads, said inner leads interconnected to said semiconductor device; and (d) a molding resin encapsulating said semiconductor device, said inner leads of said leadframe and all of the heat spreader except that exposed surface having the seal ring border.

Growing community of inventors

Manteca, CA, United States of America

Serafin Padilla Pedron, Jr