Lg Chem, Ltd

Sera Kim

Kwang Joo Lee

Ji Ho Han

Seung Heon Lee

Ji Young Hwang

Jooyeon Kim

Sang Hwan Kim

Chang Yoon Lim

Ji Eun Myung

Noma Kim

Eun Yeong Kim

Mun Seop Song

Bora Yeon

Mi Seon Yoon

Sukky Chang

Michael J Kim

Sung Chan Park

Kwang Su Seo

Mi Jang

Mi Jin Jang

Anna Lee

Sungchul Lim

The present disclosure relates to an adhesive sheet for temporary attachment which is excellent in heat resistance and can realize sufficient adhesive strength even when being subjected to a high temperature process during the semiconductor production process, and can exhibit a sufficient reduction in adhesive strength due to photocuring in a peeling step, and a method for producing a semiconductor device using the same.

Adhesive sheet for temporary attachment and method for producing semiconductor device using the same

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same

The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.

Adhesive composition

A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.

Back-grinding tape

The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0&#xb0; C. or higher, wherein the polymer resin layer has a glass transition temperature of &#x2212;30&#xb0; C. to 0&#xb0; C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.

Back grinding tape

The present specification relates to a heating element and a method for manufacturing the same.

Method for manufacturing heating element

Heating element

The present invention relates to a pressure-sensitive adhesive composition, and more precisely, a pressure-sensitive adhesive composition containing an organic silane compound that exhibits excellent initial adhesive strength on a substrate, and does not leave any of the adhesive behind when removed because the adhesive power is not excessively increased even at high temperature or at high temperature and high humidity.

Pressure-sensitive adhesive composition

The present invention relates to a novel organic silane compound, and more particularly, to a novel organic silane compound, useful in various applications, for the purpose of improving the affinity of an organic resin to an inorganic filler or improving the adhesion of a coating layer comprising matrix resin to a substrate. It is particularly useful for improving the adhesion of a polarizing plate adhesive for a liquid crystal display to a glass substrate, with little change over time even under hot and humid conditions.

Organic silane compound

Growing community of inventors

Daejeon, South Korea

Sera Kim