Lg Innotek Co., Ltd.

Samsung Electronics Co., Ltd.

Seonyoung Kim

Minsoo Kim

Junghyun Lee

Taemin Ha

Seongcheol Jeong

Young-Chul Park

WooRam Myung

Hyesun Yoon

An optical image stabilization OIS unit including a base; a holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the bobbin and the outer blade; a first coil disposed on the bobbin; a magnet configured to move the bobbin by interacting with the first coil; a second coil configured to move the holder module by interacting with the magnet; a wire electrically connected with the first coil through the spring member; and a buffer unit connected with the wire. The buffer unit has a curved shape having a curvature.

Camera module having a buffer unit

An optical image stabilization OIS unit including a base; a holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the bobbin and the outer blade; a first coil disposed on the bobbin; a magnet configured to move the bobbin by interacting with the first coil; a second coil configured to move the holder module by interacting with the magnet; a wire electrically connected with the first coil through the spring member; and a buffer unit connected with the wire, wherein the buffer unit has a curved shape having a curvature.

Disclosed are laser bonding apparatuses and methods, The laser bonding apparatus comprises a stage configured to receive a substrate, a laser device that may be disposed on the stage and is configured to irradiate a laser beam onto the substrate, a first rotation support disposed outside of the stage and is configured to drivee the laser device to rotate in an azimuthal angle direction, and a second rotation support configured to support the laser device and configured to drive the laser device to rotate in a polar angle direction intersecting the azimuthal angle direction.

Laser bonding apparatus and method

A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

Camera module including a wire for OIS function

Camera module and optical image stabilizing unit

Camera module

Provided is an imaging lens, including, in an ordered way from an object side, a first lens having positive (+) refractive power, a second lens having negative (&#x2212;) refractive power and having a meniscus shape concavely formed at an object side surface, and a third lens having positive (+) refractive power and having an aspheric shape. An object side surface and an image side surface of the third lens can each have an inflection point.

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Seoul, South Korea

Seonyoung Kim