Qualcomm Incorporated

Seongryul Choi

Houssam Jomaa

Kuiwon Kang

Layal Rouhana

A device comprising a semiconductor die, a package substrate coupled to the semiconductor die, and an encapsulation layer that at least partially encapsulates the semiconductor die. The package substrate includes at least one stacked via. The at least one stacked via includes a first via and a second via coupled to the first via. The second via includes a seed layer coupled to the first via. The second via includes a different shape than the first via. The package substrate includes a prepreg layer. The package substrate includes a first pad coupled to the first via, and a second pad coupled to the second via.

Growing community of inventors

Seongnam, South Korea

Seongryul Choi