Samsung Electronics Co., Ltd.

Hewlett-packard Development Company, L.p.

Seongho Park

Yongkong Siew

Wontaek Kim

Doo-Hwan Park

Junhui Kim

Woongyong Choi

Taeung Jung

Kyoungpil Park

Younghoon Kim

Seunggweon Lee

Eun-Chul Seo

Sungjin Kim

Hwanghee Ryu

Aee Young Park

Hohyun Hwang

Kyungmin Chung

Mintae Kim

Cheolju Hwang

Saehoon Han

An intermediate transfer belt assembly includes an intermediate transfer roller located on an inner side of an intermediate transfer belt to support the intermediate transfer belt, an accommodation portion to accommodate foreign matter, the accommodation portion having an inlet open toward the intermediate transfer belt, and a shutter to open or close the inlet.

Intermediate transfer belt assembly with shutter structure

An example image forming apparatus includes a main body including an opening and an accommodation portion, a development cartridge detachable from the main body, a tray on which to mount the development cartridge, the tray being movable between a mounting position inserted into the main body through the opening, a withdrawal position extracted from the main body, and an accommodation position at which the development cartridge is accommodated in the accommodation portion, and an elastic support member to elastically support the development cartridge with respect to the tray while the tray moves between the mounting position, the withdrawal position, and the accommodation position.

Structure for mounting development cartridge in image forming apparatus

Provided is a data management method of a server, including receiving, from a first server, first data, in which a first identification (ID) associated with a device and a first encryption identification (ID) that encrypts an ID associated with an advertisement are mapped and second data, in which a second ID associated with the advertisement and a second encryption ID that encrypts an ID associated with the device are mapped; converting a second encryption ID associated with an electronic device, received from a second server, to the second ID based on the second data, and transmitting the converted second ID and third data to an advertisement service server; and converting a first encryption ID associated with the electronic device, received from a third server, to the first ID based on the first data, and transmitting the converted first ID and fourth data to a general service server.

Server and data management method

A method of manufacturing a semiconductor device may include forming a hardmask layer on a substrate, forming a first mold pattern on the hardmask layer using a first photolithography process, conformally forming a spacer layer on the first mold pattern and on portions of the hardmask layer exposed by the first mold pattern, forming a first mold layer using a second photolithography process. The first mold layer may have a first opening that exposes a portion of the spacer layer. The method may include forming a spacer pattern by anisotropically etching the portion of the spacer layer exposed by the first opening until a portion of a top surface of the hardmask layer is exposed, and using the spacer pattern as an etching mask to pattern the hardmask layer.

Semiconductor device and method of manufacturing the same

A support device and an image forming apparatus having the same are provided. The support device according to an example includes a first lever rotatably disposed at a door provided in a body of an image forming apparatus, and a first elastic member to rotate the first lever disposed at a first position based on the door being closed to a second position based on the door being opened, wherein, at the second position, the first lever supports a part of a toner cartridge tray pulled out from the body.

Support device and image forming apparatus having the same

Methods of fabricating a semiconductor device include forming a lower interlayer insulating layer and a conductive base structure, and forming a middle interlayer insulating layer covering the lower interlayer insulating layer and the conductive base structure. The methods include etching the middle interlayer insulating layer to form a via hole and an interconnection trench vertically aligned with the via hole, and forming a via barrier layer on inner walls of the via hole and an interconnection barrier layer on inner walls and a bottom of the interconnection trench, the via barrier layer not being formed on an upper surface of the conductive base structure The methods include forming a via plug on the via barrier layer to fill the via hole, forming a seed layer on the interconnection trench and the via plug, forming an interconnection electrode on the seed layer, and forming an interconnection capping layer on the interconnection electrode.

Methods of fabricating a semiconductor device having a via structure and an interconnection structure

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Suwon-si, South Korea

Seongho Park