Samsung Electronics Co., Ltd.

Seongha Jeong

Dougyong Sung

Ungyo Jung

Jongwoo Sun

Donghyeon Na

Dongwan Kim

Jewoo Han

Kangmin Jeon

Myeongsoo Shin

Dongseok Han

Minkyu Sung

Cheonkyu Lee

Iksu Byun

Kimoon Jung

Moonseok Kim

Changwoo Song

A chuck assembly includes a chuck base including a lower base and an upper base that is on the lower base, a ceramic plate on the upper base, an isolator ring enclosing an outer sidewall of the lower base, a focus ring on an edge portion of the lower base and the isolator ring, the focus ring enclosing an outer sidewall of the upper base, and a pad that is between the edge portion of the lower base and the focus ring. The pad may contain a nonmetal conductive material.

Chuck assembly, fabrication system therewith, and method of fabricating semiconductor device using the same

A gas supply assembly for a substrate processing apparatus includes a gas introduction part, a gas distribution plate connected to the gas introduction part, the gas distribution plate including a plurality of through holes, and a shower head disposed under the gas distribution plate, the shower head including a plurality of distribution holes in fluid communication with the plurality of through holes. One through hole is in fluid communication with at least two distribution holes, and each of the plurality of distribution holes has a first diameter and a second diameter differing from each other in the shower head.

Gas supply assembly and substrate processing apparatus including the same

A method of etching at a low temperature includes cooling a pedestal on which a wafer is disposed, etching the wafer by generating plasma from a gas supplied through a gas distribution unit, and injecting a heated inert gas into the chamber through the gas distribution unit.

Method of etching at low temperature and plasma etching apparatus

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Hwaseong-si, South Korea

Seongha Jeong