Samsung Electronics Co., Ltd.

Seonggi Jeon

Bongsu Cho

Sangil Choi

Heeseok Nho

A substrate transfer apparatus includes: a body including a first surface to which a semiconductor substrate is suctioned and a second surface opposing the first surface, the first surface including a cavity disposed in a center region of the body and an attaching unit disposed on an edge of the body so as to surround the cavity and form negative pressure to suction the semiconductor substrate, and a connector connected to the second surface of the body and supporting the body, wherein the cavity includes a lower surface with at least one through hole penetrating the first and second surfaces of the body and connecting the cavity to an external space, and the cavity includes a side surface inclined at an angle of 2.9&#xb0; to 5&#xb0; with respect to the first surface at the edge of the body.

Growing community of inventors

Jeungpyeong-gun, South Korea

Seonggi Jeon