Samsung Techwin Co., Ltd.

Seong-young Han

Jae-chul Ryu

Chang-soo Jang

Bruce Kim

Boo-Yang Jung

There are provided a printed circuit board having a structure for relieving a stress concentration on an outer most lead of leads, due to a difference in thermal expansion coefficients between the semiconductor device and the printed circuit board when the semiconductor device is mounted on the printed circuit board. The printed circuit board includes an inner lead portion to be connected to the semiconductor device. The inner lead portion includes a plurality of leads, arranged in parallel with a same pitch in a predetermined area, and additional leads located near both ends of the predetermined area in which the plurality of leads are arranged in parallel, respectively, wherein each of the plurality of leads has a pitch smaller than 30 &#x3bc;m and a width of the additional lead is wider than 20 &#x3bc;m. There are also provided a semiconductor chip package equipped with the printed circuit board according to the present invention.

Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same

Provided is an apparatus for detecting a defect of a circuit pattern which includes a resonator, a first power supply unit connected to one end of the resonator to apply power to the resonator, a probe connected to the other end of the resonator to contact one end of the circuit pattern, a second power supply unit connected to the other end of the circuit pattern to apply a voltage thereto, and a detection portion connected between the resonator and the probe to measure a voltage generated from the circuit pattern and generate a measurement voltage, and determine presence of a defect in the circuit pattern from the measurement voltage.

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Yongin-si, South Korea

Seong-young Han