Samsung Led Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Seong Yeon Han

Young Sam Park

Hun Joo Hahm

Hyung Suk Kim

Kyung Taeg Han

Seon Goo Lee

Dae Yeon Kim

Do Hun Kim

Young June Jeong

Chul Hee Yoo

Dae Hyun Kim

Jung Park

Chang Ho Song

Ho Yeon Kim

Ho Sik Ahn

In Tae Yeo

Myoung Soo Choi

Yoon Sung Na

Dae Cheon Kim

A white light emitting device including: a blue light emitting diode chip having a dominant wavelength of 443 to 455 nm; a red phosphor disposed around the blue light emitting diode chip, the red phosphor excited by the blue light emitting diode chip to emit red light; and a green phosphor disposed around the blue light emitting diode chip, the green phosphor excited by the blue light emitting diode chip to emit green light, wherein the red light emitted from the red phosphor has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905) and (0.4794, 0.4633) based on the CIE 1931 chromaticity diagram, and the green light emitted from the green phosphor has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316) and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram.

White light emitting device and white light source module using the same

An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

Light emitting diode package and fabrication method thereof

There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.

Light emitting module

There are provided a plane light source and an LCD backlight unit having the same. A plane light source including light emitting device matrixes each having a plurality of light emitting devices arranged in rows and columns on a substrate according to an aspect of the invention includes: a first matrix having a plurality of light emitting devices arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, the light emitting devices each located within a rectangle formed by four adjacent light emitting devices included in the first matrix, and forming angles &#x3b8; satisfying the condition of 45&#xb0;&#x2266;&#x3b8;&#x2266;55&#xb0; therebetween on the basis of a horizontal direction, wherein among pitches between one light emitting devices included in the light emitting device matrixes and another lighting light emitting device adjacent to the light emitting device, a pitch P1 between the light emitting device and the light emitting device diagonally across from the light emitting device satisfies the condition of 25 mm&#x2266;P&#x2266;29 mm, and a pitch Pbetween the light emitting device and another light emitting device located in a horizontal direction satisfies the condition of 34 mm&#x2266;P&#x2266;38 mm.

Plane light source and LCD backlight unit having the same

A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

Chip coated light emitting diode package and manufacturing method thereof

The present invention provides a light emitting diode package which includes a lead frame with a cavity; a mold exposing the cavity and housing the lead frame; and an LED chip mounted on the cavity, wherein light passing an upper edge of the LED chip passes an upper edge of the cavity.

Light emitting diode package including a lead frame with a cavity

There is provided a backlight unit including: a chassis having an insulating layer formed on a top thereof; a circuit pattern formed on the insulating layer; a plurality of light emitting diodes formed on the insulating layer to electrically connect to the circuit pattern.

Backlight unit having light emititng diodes and method of manufacturing the same

There are provided a plane light source and an LCD backlight unit having the same. A plane light source including light emitting device matrixes each having a plurality of light emitting devices arranged in rows and columns on a substrate according to an aspect of the invention includes: a first matrix having a plurality of light emitting devices arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, the light emitting devices each located within a rectangle formed by four adjacent light emitting devices included in the first matrix, and forming angles &#x3b8; satisfying the condition of 45&#xb0;&#x2266;&#x3b8;&#x2266;55&#xb0; therebetween on the basis of a horizontal direction, wherein among pitches between one light emitting devices included in the light emitting device matrixes and another lighting light emitting device adjacent to the light emitting device, a pitch Pbetween the light emitting device and the light emitting device diagonally across from the light emitting device satisfies the condition of 25 mm&#x2266;P&#x2266;29 mm, and a pitch Pbetween the light emitting device and another light emitting device located in a horizontal direction satisfies the condition of 34 mm&#x2266;P&#x2266;38 mm.

Growing community of inventors

Gwangju, South Korea

Seong Yeon Han