Samsung Electronics Co., Ltd.

Seong-woon Booh

Jin-woo Cho

Dong-Woo Lee

Ki-Taek Kim

Dong-ok Kwak

Baik-woo Lee

Che-Heung Kim

Chang-sik Kim

Chang-mo Jeong

Young-hun Byun

Young-Ki Kim

Su-ho Shin

Young-ki Kim

Ji-Hyuk Lim

Su-gun Kim

Jong-min Wang

Che-heung Kim

Jeong-Won Yoon

Choong-Sik Kim

Eun-deok Bae

Yun-mi Seo

According to example embodiments, a substrate for a power module includes a first part, a second part, and a third part on a same surface of an underlying part of the substrate. The first part, the second part, and the third part may be spaced apart from each other, electrically insulated from each other, and not directly contacting each other. The third part may surround the first part and the second part. A first element module may be on the third part. The first part, the second part, and the third part may be conductive.

Substrate and terminals for power module and power module including the same

According to example embodiments, a substrate for a power module includes first to third parts spaced apart from each other, where the third part surrounds the first and second parts, and a conductive layer on the first to third parts. A terminal of a first polarity is connected to the first part, and a terminal of a second polarity is connected to the second part. The first and second terminals may be spaced apart from each other and each have a coupling part, a body, and a contact part. The bodies of the first and second terminals may overlap each other. A power module may include the substrate.

Semiconductor device packages and methods of manufacturing the semiconductor device packages are provided. A semiconductor device package may include a bonding layer between a substrate and a semiconductor chip, and the bonding layer may include an intermetallic compound. The intermetallic compound may be a compound of metal and solder material. The intermetallic compound may include AgSn. A method of manufacturing the semiconductor device package may include forming a bonding layer, which bonds a semiconductor chip to a substrate, by using a mixed paste including metal particles and a solder material. The bonding layer may be formed by forming an intermetallic compound, which is formed by heating the mixed paste to react the metal particles with the solder material.

[object Object]

Provided are a substrate for a power module having a uniform parallel switching characteristic and a power module including the same. The substrate for the power module includes a plurality of areas on which input terminals are mounted, an area on which an output terminal is mounted, a plurality of areas on which devices are mounted, and an area on which a plurality of control pins are mounted. The plurality of areas on which the devices are mounted are bilaterally symmetric about the area on which the plurality of control pins are mounted. The plurality of areas on which the input terminals are mounted, respectively, are provided into three areas spaced apart from each other and bilaterally symmetric to each other. The plurality of areas on which the device are mounted are bilaterally symmetric about the area on which the control pins are mounted.

Substrate for power module having uniform parallel switching characteristic and power module including the same

A power semiconductor device may comprise: a lower structure; a solder layer on the lower structure; a semiconductor structure on the solder layer; a contact layer on the semiconductor structure; a pad layer on the contact layer; and/or a wire between the pad layer and the lower structure. The solder layer may be electrically connected to a first electrode of the semiconductor structure.

Power semiconductor devices

According to example embodiments of inventive concepts, a power device includes a semiconductor structure having a first surface facing a second surface, an upper electrode, and a lower electrode. The upper electrode may include a first contact layer that is on the first surface of the semiconductor structure, and a first bonding pad layer that is on the first contact layer and is formed of a metal containing nickel (Ni). The lower electrode may include a second contact layer that is under the second surface of the semiconductor structure, and a second bonding pad layer that is under the second contact layer and is formed of a metal containing Ni.

Power device and power device module

A multilayer laminate package and a method of manufacturing the same are provided. The multilayer laminate package includes a cavity layer, a non-cavity layer, an electronic component, and a metalized blind via. The cavity layer includes a first adhesive layer and two first circuit layers, which are stacked with the first adhesive layer between, and an opening. The non-cavity layer includes a second adhesive layer and a second circuit layer. The non-cavity layer is bonded to the cavity layer with the second adhesive layer so as to close one side of the opening. The electronic component is mounted in the opening and is electrically connected to the non-cavity layer exposed through the opening. The metalized blind via electrically connects the non-cavity layer to one of the circuit layers of the cavity layer.

Multilayer laminate package and method of manufacturing the same

A method and apparatus for generating a three-dimensional FEM are provided. In the three-dimensional FEM generating method, a surface mesh is generated by meshing the surface of a three-dimensional model of a three-dimensional object. A projected contour is generated by projecting the three-dimensional model from one direction, and a projected contour mesh is generated by meshing the surface of the projected contour. A solid base mesh is generated by stacking solid elements on a base side formed of two-dimensional elements of the projected contour mesh. The surface mesh is substituted into the solid base mesh in alignment with the projected contour. A final solid mesh is generated by distinguishing solid elements surrounded by the surface mesh in the solid base mesh.

Method and apparatus for generating three-dimensional finite element mesh

A terminal includes a lower housing; an upper housing slidably installed with respect to the lower housing; and a pressing member with both ends being supported by the lower and upper housings, respectively, for providing variable levels of pressure in diverse directions according to a sliding position of the upper housing with respect to the lower housing, wherein one end of the pressing member is movably linked to the lower housing. The small-sized pressing member provides a maximum level of pressure to facilitate the sliding movement of the upper housing with respect to the lower housing. Thus, space utilization can be improved.

Terminal

A flexible printed circuit board is robust to a repeated twisting and consists of a minute circuit printed on a flexible insulated material sheet, and has the bent parts of the opposite edges symmetrical in structure. The bent parts are straightened out when twisting occurs. In the flexible printed circuit board, the opposite edges are longer in length than the middle part such that the tensile deformation at the opposite edges at the time of twisting does not occur or is minimized.

Flexible printed circuit board

A liquid crystal on silicon (LCOS) device includes a wafer, glass, and walls formed at opposite ends of an upper surface of the wafer to define a predetermined cell gap between the glass and the wafer. A thin piezo-electric layer is attached onto a surface of the wafer and an electrode is applied with external power to expand and/or contract the thin piezo-electric layer. The LCOS device further includes a voltage detection unit for detecting a voltage generated by the deformation of the thin piezo-electric layer; and a feedback control unit for compensating for deformation of the thin piezo-electric layer according to the voltage detected by the voltage detection unit. The LCOS device achieves uniformity of the cell gap by adjusting the voltage level of the thin piezo-electric layer after bonding the wafer and the glass, and therefore, spacers are not required.

Liquid crystal on silicon (LCOS) display device having a uniform cell gap

A method for fabricating liquid crystal panel including providing a first and second substrates, attaching the first substrate to the second substrate with a predetermined gap, fixing the attached first and second substrates in a state bent into the predetermined radius of curvature such that tension can be applied to a predetermined cutting surface of the first substrate, forming a crack on the predetermined cutting surface using a scribing wheel, cutting the substrates by applying mechanical force to the first and the second substrates on which the crack is formed, and injecting liquid crystal into each of cut liquid crystal cells.

Scribing method and apparatus of liquid crystal panel, method for fabricating liquid crystal panel

A slide opening/closing type mobile device includes a body section including a guide section that has a pair of long holes and is configured so that an interval between the pair of long holes becomes smaller at first, as it goes from one ends towards the other ends of the long holes, and then, becomes larger based on certain starting points; a slider provided with guide rollers movably inserted in the pair of long holes of the guide section in a state of being elastically biased to the outside; a rotation plate rotatably mounted on the slider; and a display section mounted on the rotation plate. The display section is slidable upward and downward with respect to the body section by the slider, and rotates at a predetermined angle by the rotation plate.

Slide opening/closing type mobile device

An LCD module is provided for use in a hand-held portable phone, which is eminently improved in impact-resistant property. The LCD module includes an LCD panel, a mold frame for receiving and supporting the LCD panel, and a chassis for reinforcing the rigidity of the mold frame, wherein the mold frame and the chassis are integrally insert-molded.

Growing community of inventors

Yongin-si, South Korea

Seong-woon Booh