Samsung Electronics Co., Ltd.

Seong Wook Cheong

Hyuk Kim

Sang Jin Choi

Tae Yun Lee

Byeong Kap Choi

Chong Uck Kim

Sano Jin Choi

Byung Il Ahn

Eun Seon Lim

Joong He Lee

An apparatus for manufacturing a semiconductor package includes at least a first mold, a rotator, and a driver. The first mold has a first mold section, a second mold section, and at least one cavity formed when the first mold section and the second mold are brought together. The rotator is coupled to the first mold, and the driver is between the first mold and a rotating axis of the rotator. The driver supplies a molding resin into the cavity based on centrifugal force generated when the rotator rotates on the rotating axis.

Apparatus for manufacturing a semiconductor package

A drop mass deviation measuring apparatus, a drop mass deviation measuring method, a pattern forming system, and a control method measure mass deviations of drops discharged from a plurality of drop discharge units in real time with high precision. The apparatus utilizes a plurality of drops discharged from a plurality of drop discharge units, a drop moving force providing part to provide moving forces, having directions different from discharge directions of each of the plurality of drops, to the plurality of drops, a discharged drop position detection member to acquire drop position images individually reflecting the a position of each of the plurality of drops, and a drop mass deviation measurement control part to calculate a drop discharge direction separation angle of each of the plurality of drops using the drop position images acquired by the discharged drop position detection member to measure mass deviation of each of the drops.

Drop mass deviation measuring apparatus, drop mass deviation measuring method of the same, pattern forming system using the same, and control method of the pattern forming system using the same

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Seongnam-si, South Korea

Seong Wook Cheong