Stats Chippac Pte. Ltd.

Seong Won Park

Hun Teak Lee

DeokKyung Yang

SungWon Cho

HeeSoo Lee

KyungHoon Lee

In Sang Yoon

KyungOe Kim

Ki Youn Jang

YoungChul Kim

MinJung Kim

JoonYoung Choi

JaeHyun Lee

GwangTae Kim

SungEun Park

Cheng Yu Hsia

WoonJae Beak

Yong Suk Kim

ChangHwan Kim

ByungHyun Kwak

A system and method of manufacture of an integrated circuit packaging system includes: a copper film; a first metal layer directly on the copper film; an insulation layer directly on and over the first metal layer, the insulation layer having a via hole through the insulation layer; a conductive via within the via hole and directly on the first metal layer; a second metal layer directly on the conductive via and the insulation layer; a copper post directly on the copper film; a solder pad over the copper post; and an interposer coupled to the copper post and the solder pad.

Integrated circuit packaging system with plated copper posts and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a connection post to the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; and forming a package body on the substrate, the connection post, and the integrated circuit die.

Integrated circuit packaging system with connection structure and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system including: heating a support structure having a conductive pad and an organic surface protection layer on the conductive pad; removing the organic surface protection layer from the conductive pad by a plasma process with a two-step method, the two-step method includes a first step with a dioxygen and a second step with a dihydrogen, wherein the second step immediately follows the first step; and forming an underfill over the conductive pad.

Method of manufacture of integrated circuit packaging system with plasma processing

A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.

Molding compound flow controller

Growing community of inventors

Icheon-si, South Korea

Seong Won Park