Samsung Electro-mechanics Co., Ltd.

Seong Ryul Choi

Suk Chang Hong

Sang Kab Park

Kwang Seop Youm

Disclosed herein are a printed circuit board, a manufacturing method thereof, and a semiconductor package including the printed circuit board. The printed circuit board includes a base substrate including a plurality of circuit patterns, a cavity formed above the base substrate, a pad embedded in the base substrate and being exposed through the substrate bottom surface of the cavity, and an electronic component mounted in the cavity and electrically connected to the pad. According to the present invention, a cavity having a predetermined depth is formed in a base substrate of a printed circuit board so as to mount an electronic component therein, such that a gap between an upper semiconductor package and a lower semiconductor package may be obtained even if pitches between the balls are decreased for high density and high performance of the upper semiconductor package in the manufacturing of a semiconductor package having a PoP structure.

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Seoul, South Korea

Seong Ryul Choi