Snu Precision Co., Ltd.

Seong Ryong Kim

Heui Jae Pahk

Woo Jung Ahn

Sang Soo Kang

Jun Hyeok Lee

Tae Yong Jo

Young Min Hwang

Provided herein is a three-dimensional shape measurement apparatus capable of measuring a shape of a measurement object using an interferometer and color information of the measurement object, the apparatus including a light source for emitting a light; a light divider for reflecting the light emitted from the light source or transmitting a light reflected by the measurement object; a lens unit for focusing the light reflected by the light divider onto the measurement object; a light detector for detecting the light reflected from the measurement object; and a light adjuster arranged on a light path between the light source and the light divider, and configured to interrupt the light being emitted from a central area of the light source to reduce interference of light occurring in the lens unit.

Three-dimensional shape measuring device capable of measuring color information

Disclosed is a method of measuring thickness or a surface profile of a thin film layer formed on a base layer through a white light scanning interferometry, the method including: preparing simulation interference signals corresponding to thicknesses by assuming a plurality of sample thin film layers different in thickness from one another and simulating interference signals with respect to the respective sample thin film layers; acquiring a real interference signal with respect to an optical-axis direction of entering the thin film layer by illuminating the thin film layer with white light; preparing a plurality of estimated thicknesses that the thin film layer may have on the basis of the real interference signal; comparing whether the simulation interference signal having thickness corresponding to the estimated thickness is substantially matched with the real interference signal; and determining the thickness of the simulation interference signal substantially matched with the real interference signal as the thickness of the thin film layer.

Estimating thickness based on number of peaks between two peaks in scanning white light interferometry

Growing community of inventors

Seoul, South Korea

Seong Ryong Kim