Samsung Electro-mechanics Co., Ltd.

Seong Min Cho

Chi Seong Kim

Jung Youn Pang

Dong Jun Lee

Dong Ju Jeon

Jae Hun Kim

Yong Hui Li

Sang Seob Kim

Kyung Ah Lee

Chang Gun Oh

Young Ku Lyu

Eo Jin Choi

Tae Kyun Bae

Chang Hyun Shin

Keung Jin Sohn

Eun Heay Lee

Shimoji Teruaki

Hyun Jung Hong

A coil component includes a body, a coil portion embedded in the body, and external electrodes electrically connected to the coil portion. The coil portion includes coil patterns having trenches formed in surfaces thereof. The trenches extend through a partial thickness of the coil portion, and are located at aligned locations in adjacent windings of the coil portion. A method of forming the coil component includes forming a mask pattern having a coil shaped opening and including a plurality of bridges extending across the coil shaped opening in the mask pattern.

Coil component

A coil component includes a magnetic body and a coil portion embedded in the magnetic body. The coil portion includes an internal insulating layer, coil patterns disposed on opposite surfaces of the internal insulating layer, an insulating wall disposed between turns of a coil pattern, an external insulating layer disposed on the insulating wall and the coil pattern, and a connection portion including a first conductive layer and a second conductive layer having a melting point lower than a melting point of the first conductive layer, and penetrating through the internal insulating layer to connect the coil patterns disposed on the opposite surfaces of the internal insulating layer to each other.

Coil component and method of manufacturing the same

An electroless surface treatment plated layer of a printed circuit board, a method for preparing the same, and printed circuit board including the same. The electroless surface treatment plated layer includes: electroless nickel (Ni) plated coating/palladium (Pd) plated coating/gold (Au) plated coating, wherein the electroless nickel, palladium, and gold plated coatings have thicknesses of 0.02 to 1 &#x3bc;m, 0.01 to 0.3 &#x3bc;m, and 0.01 to 0.5 &#x3bc;m, respectively. In the electroless surface treatment plated layer of the printed circuit board, a thickness of the nickel plated coating is specially minimized to 0.02 to 1 &#x3bc;m, thereby making it possible to form an optimized electroless Ni/Pd/Au surface treatment plated layer.

Electroless surface treatment plated layers of printed circuit board and method for preparing the same

There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd&#x2014;P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.

Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board

Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

Carrier for manufacturing a printed circuit board

Growing community of inventors

Gwangmyeong-si, South Korea

Seong Min Cho