Samsung Electro-mechanics Co., Ltd.

Seong Min Chin

Jang Yeol Lee

Yu Ra Shin

Hak Kwan Kim

Myeong Gi Kim

Eung Soo Kim

Je Ik Moon

Tae Young Kim

Sung Soo Kim

Hye Yeon Cha

Moon Soo Park

Hwan Soo Lee

Hak Do Kim

Myeong Gil Kim

Ye Eun Jung

Jong Hun Kim

Ye Eun Jeong

A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.

Acrylic binder and multilayer electronic component using the same

A conductive powder for an internal electrode includes a metal particle; and a graphene layer or an oxidized graphene layer disposed on at least a portion of a surface of the metal particle.

Conductive powder for inner electrode and capacitor

A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to face each other with at least one among the plurality of dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part. The inductor and the capacitor are coupled to each other by an adhesive containing a first epoxy resin including a urethane modified epoxy (UME) resin, a second epoxy resin including a bisphenol A type resin, and a latent curing agent.

Composite electronic component

The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: a core substrate having a conductive pattern on the surface and a magnetic layer for covering the core substrate not to expose the conductive pattern, wherein the magnetic layer is made of a metal-polymer composite and has a multilayer structure.

Inductor and method for manufacturing the same

There is provided a chip electronic component including: a magnetic body containing magnetic metal powder particles and a thermosetting resin; an internal coil part embedded in the magnetic body; and a surface protection layer with which a surface of the magnetic body is coated. The surface protection layer may prevent a plating spreading phenomenon occurring on a surface of the chip electronic component at the time of forming external electrodes.

Chip electronic component and board having the same

Growing community of inventors

Suwon-si, South Korea

Seong Min Chin