Samsung Electronics Co., Ltd.

Seong Hwan Oh

Kyung Suk Oh

Kyungjae Kim

Kwanwoo Song

Kilsoo Kim

Hyejung Cho

Jeongil Seo

Sunggeun Song

Hunjung Lim

Daeeun Yi

An air-conditioning control method for an electronic device is provided that includes determining a rate of temperature change on the basis of changes in the temperature measured for the first time; acquiring first density information on the basis of the determined rate of temperature change and information on a location at which the temperature change is measured; and controlling air-conditioning according to the first density information.

Electronic device and air-conditioning control method therefor

A semiconductor package may include a package substrate, a first semiconductor chip on the package substrate, and a second semiconductor chip on the first semiconductor chip. The first semiconductor chip comprises a chip substrate including a first surface and a second surface opposite to the first surface, a plurality of first chip pads between the package substrate and the chip substrate, and electrically connecting the first semiconductor chip to the package substrate, a plurality of second chip pads disposed on the second surface and between the second semiconductor chip and the second surface, and a plurality of redistribution lines on the second surface, the redistribution lines electrically connecting to the second semiconductor chip, and a plurality of bonding wires electrically connecting the redistribution lines to the package substrate.

Semiconductor chip and semiconductor package including the same

Growing community of inventors

Gyeonggi-do, South Korea

Seong Hwan Oh