Lg Innotek Co., Ltd.

Seong Hwan Im

Jun Young Lim

Hyung Kyu Yoon

Dae Sung Yoo

Jung Myung Min

Jong Seok Park

Chang Je Kim

Ki Tae Kwon

Gi Uk Yang

Seon Mo Gu

A circuit board according to an embodiment includes a first substrate layer; a second substrate layer disposed on the first substrate layer; and a third substrate layer disposed under the first substrate layer; wherein the second substrate layer includes: a first inner circuit pattern layer disposed on the first substrate layer; and a first outermost circuit pattern layer disposed on the first inner circuit pattern layer; wherein the third substrate layer includes: a second inner circuit pattern layer disposed under the first substrate layer; and a second outermost circuit pattern layer disposed under the second inner circuit pattern layer; wherein a thickness of the first outermost circuit pattern layer is greater than a thickness of each of the first inner circuit pattern layer and the second inner circuit pattern layer.

Circuit board

A fingerprint recognition module according to an embodiment comprises: a substrate; a conductive pattern portion disposed on the substrate; a protective layer partially disposed on one region of the conductive pattern portion; a first chip disposed on the conductive pattern portion exposed through a first open region of the protective layer; and a second chip disposed on the conductive pattern portion exposed through a second open region of the protective layer, wherein the first chip is a fingerprint recognition sensor, the second chip is an application specific integrated circuit, the substrate includes a first non-bending region located at one end thereof, a second non-bending region located at the other end opposite to the one end, and a bending region located between the first and the second non-bending region, the first open region is located on the first non-bending region, and the second open region is located on the second non-bending region.

Fingerprint recognition module and electronic device comprising same

A flexible circuit board for all-in-one chip on film according to an embodiment may include: a substrate; a conductive pattern part disposed on the substrate; and a protective layer partially disposed on the conductive pattern part, wherein the conductive pattern part includes a first conductive pattern part and a second conductive pattern part which are spaced apart from each other, each of the first conductive pattern part and the second conductive pattern part includes a wiring pattern layer, a first plating layer, and a second plating layer that are sequentially placed on the substrate, the first conductive pattern part includes a first open region in which the protective layer is open, the second conductive pattern part includes a second open region in which the protective layer is open, and a content of tin of the second plating layer in the first open region is greater than that of the second plating layer in the second open region.

Flexible circuit board for all-in-one chip on film, chip package including same, and electronic device including same

Growing community of inventors

Seoul, South Korea

Seong Hwan Im