Samsung Electronics Co., Ltd.

Seong-Chan Han

Hyo-Jae Bang

Dong-chun Lee

Dong-Woo Shin

Jung-Hyeon Kim

Jung-Hoon Kim

Heui-seog Kim

Hyun-Jong Oh

Hun Taek Han

Kwang-Su Yu

Nam-Yong Oh

Jae-Hoon Choi

Young-Soo Lee

Dong-Chun Lee

Sun-Kyu Hwang

Jun-Young Lee

Jae-Young Kim

Sung-Hwan Kim

Ho-Geon Song

Hyun-Seok Choi

Han-Ju Kim

Yong-Hyun Kim

Sun-kyu Hwang

Joo-han Lee

Jae-Seon Hwang

Chang-kun Kang

Kyung-du Kim

Si-Suk Kim

Wang-Jae Lee

Young-rock Lee

Chan-Hyung Yun

Chil-hoon Lee

Han-ju Kim

Young-Rock Lee

A dispenser includes a syringe container having a first end and a second end, the syringe container having a length direction extending between the first end and the second end, a plunger movable within the syringe container along the length direction of the syringe container and configured to be positioned on a surface of an underfill solution to be received within the syringe container at a first region between the plunger and the second end, a cap attached airtightly to the first end of the syringe container, a first gas supply line configured to supply a first gas into the syringe container through the cap, and a second gas supply line extending from the cap to the plunger, the second gas supply line being in fluid communication with the first region and configured to supply a second gas into the underfill solution to be received within the syringe container at the first region through a through hole of the plunger.

Underfill solution supplying device for a dispenser, dispenser including the same, and method of manufacturing a semiconductor module using the same

A method of manufacturing a semiconductor package includes preparing a package substrate including a semiconductor chip mounting region. A semiconductor chip is mounted in the semiconductor chip mounting region. A dam surrounding the semiconductor chip is formed. The formation of the dam includes depositing a first solution having a temperature below a set first temperature. A region under the semiconductor chip and a region defined by the dam are filled with an underfill by depositing the first solution having a temperature equal to or higher than the set first temperature.

Method of manufacturing semiconductor package

A router apparatus is provided. The router apparatus includes a plurality of panels stacked vertically; a router bit which cuts the panels simultaneously; a first supporting unit connected to one end of the router bit, and a second supporting unit connected to the other end of the router bit. A guide rail is formed in the second supporting unit in order to guide a movement of the router bit.

Router apparatus

A test socket may include a socket frame, a plate, a socket pin and a link. The socket frame may have a slot configured to accept an object. The plate may be free to move in the slot along an inserting direction of the object to support a lower surface of the object. The socket pin may be movably arranged in a direction substantially perpendicular to the inserting direction of the object. The socket pin may selectively make contact with a tab of the object. A link may be pivotally connected to the socket pin and the plate. Thus, the socket pin of the test socket may avoid dragging along the tab of the object during insertion, and accordingly, the tab of the object may avoid damage.

Test socket for testing electrical characteristics of a memory module

A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.

Semiconductor module socket apparatus

A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.

Semiconductor module, socket for the same, and semiconductor module/socket assembly

A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through holes which are spaced apart from each other. The first and second fillings are buried in the first and second through holes, respectively, and formed of a reflowable conductive material. The first passive element includes first and second electrodes. A first insertion groove is formed in a portion of a surface of the board member between the first and second through holes and portions of the first and second fillings. The first passive element is mounted on the first insertion groove. The first electrode includes a bottom surface and a side contacting the first filling and an exposed upper surface. The second electrode comprises a bottom surface and a side contacting the second filling and an exposed upper surface.

Reworkable passive element embedded printed circuit board

Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.

Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly

A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.

Semiconductor packaging device

In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.

Method of attaching a solder ball and method of repairing a memory module

A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Semiconductor module

A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.

Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module

A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

Semiconductor device and method of manufacturing the same

An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal pattern is provided on the board body and adjacent to the first cavity. A first electronic component is provided in the first cavity. A first connection pattern is provided adjacent to an upper edge portion of the first electronic component and extends to the first metal pattern so that the first metal pattern is electrically connected to the first electronic component.

Method of fabricating an electronic device

Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.

Growing community of inventors

Cheonan-si, South Korea

Seong-Chan Han