Lg Innotek Co., Ltd.

Seon Mo Gu

Seong Hwan Im

Chang Je Kim

Ki Tae Kwon

A circuit board according to an embodiment includes a first substrate layer; a second substrate layer disposed on the first substrate layer; and a third substrate layer disposed under the first substrate layer; wherein the second substrate layer includes: a first inner circuit pattern layer disposed on the first substrate layer; and a first outermost circuit pattern layer disposed on the first inner circuit pattern layer; wherein the third substrate layer includes: a second inner circuit pattern layer disposed under the first substrate layer; and a second outermost circuit pattern layer disposed under the second inner circuit pattern layer; wherein a thickness of the first outermost circuit pattern layer is greater than a thickness of each of the first inner circuit pattern layer and the second inner circuit pattern layer.

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Seoul, South Korea

Seon Mo Gu