Samsung Electro-mechanics Co., Ltd.

Seon Ho Park

Jung Min Kim

Chang Hak Choi

Bon Seok Koo

Jeong Ryeol Kim

Moon Soo Park

Jae Seok Yi

Sang Wook Lee

Il Ro Lee

Hong Je Choi

A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, external electrodes disposed on the body to be connected to the internal electrodes, and a metal oxide disposed between the body and the external electrodes. The metal oxide includes calcium (Ca), zinc (Zn), and silicon (Si), and further includes at least one selected from the group consisting of barium (Ba), boron (B), and aluminum (Al).

Multilayer electronic component

A multilayer electronic component includes: a body including dielectric layers and internal electrodes disposed alternately with the dielectric layers; and external electrodes disposed on the body, wherein each of the external electrodes includes: an electrode layer connected to the internal electrodes; a first intermetallic compound layer disposed on the electrode layer and including CuSn; a second intermetallic compound layer disposed on the first intermetallic compound layer and including CuSn; and a conductive resin layer disposed on the second intermetallic compound layer and including a conductive connection portion including a low melting point metal, a plurality of metal particles, and a base resin, and an average thickness of the first intermetallic compound layer is 0.5 to 2.5 &#x3bc;m.

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Suwon-si, South Korea

Seon Ho Park