Samsung Electronics Co., Ltd.

Iljin Global Co., Ltd

Lg Innotek Co., Ltd.

Seon Ho Lee

Hwail Jin

Kyung Tae Kim

Chang Ho Lee

Ki Young Song

Yeongseok Kim

Rak Jun Choi

Jun Woo Myung

Jae Kul Lee

Young Hun Han

Yoon Jeong Choi

Jongpa Hong

Oh Chul Kwon

Chirl Soo Shin

In Ha Lee

Eunyeong Kim

Yoon Gil Choi

Jin Hak Lee

Yeonseok Kim

Bu Nam Jeon

Min Woo Song

Hee Chan Shim

Ho Sung You

Tae Ho Ha

A wheel hub includes an inner hub part made of a first material and comprising a central portion formed to protrude in an axially inward direction and a flange portion formed to extend in a radially outward direction from the central portion; and an outer hub part made of a second material, which is lower in strength and lighter in weight than the first material, and configured to be integrally coupled with the inner hub part. The flange portion comprises a plurality of main extended portions in which a plurality of fastening holes are formed to penetrate in an axial direction while being arranged to be spaced apart from each other along a circumferential direction so that a wheel is mounted to the flange portion. The plurality of main extended portions are formed to extend along a plurality of virtual extension reference lines which extend in the radially outward direction.

Wheel hub and wheel bearing assembly comprising the same

A processing tape may include a base layer, an adhesive layer disposed on the base layer, a protection release film on the adhesive layer, and a first release layer interposed between the adhesive layer and the protection release film. The first release layer may include a silicone-based material and may be non-photo-curable.

Processing tape and method of fabricating a semiconductor device using the same

A semiconductor package includes a lower semiconductor chip having a lower semiconductor substrate and upper pads on a top surface of the lower semiconductor substrate, an upper semiconductor chip stacked on the lower semiconductor chip, the upper semiconductor chip including an upper semiconductor substrate and solder bumps on a bottom surface of the upper semiconductor substrate, and a curing layer between the lower semiconductor chip and the upper semiconductor chip, the curing layer including a first curing layer adjacent to the upper semiconductor chip, the first curing layer including a first photo-curing agent, and a second curing layer between the first curing layer and the top surface of the lower semiconductor substrate, the second curing layer including a first thermo-curing agent.

Semiconductor package with curing layer between semiconductor chips

Disclosed is a method of fabricating a semiconductor package. The method may include providing a preliminary interposer substrate including connection terminals on a carrier substrate such that the connection terminals are oriented outward, preparing a release film including a base layer, an intermediate layer, and an adhesive layer, attaching the connection terminals to a first surface of the release film, detaching the carrier substrate from the preliminary interposer substrate, cutting the preliminary interposer substrate to form a plurality of interposer substrates separated from each other, irradiating a first light of a first wavelength onto the release film to form an air gap between the connection terminals and the release film, and detaching the interposer substrates from the release film. The intermediate substrate may include a light absorber absorbing the first light.

Method of fabricating a semiconductor package

An electronic device and method are disclosed. The electronic device includes a processor which implements the method. The method includes: executing an application in a first state, displaying a first user interface for the application on a display, the first UI including a first input field and a first identifier identifying the first input field, receiving data input to the first input field, in response to detecting a particular event, changing the first operational state to a second operational state, re-executing the application in the second operational state, transmitting data for a second UI of the re-executed application to an external display device for display, the second UI including a second input field and a second identifier corresponding to the second input field, and inserting the received data input into the second input field when the first identifier corresponds to the second identifier.

Electronic device and method for managing data input into input field

A bearing steel according to an embodiment of the present disclosure includes, as a chemical composition: 0.51 to 0.56 wt % of carbon (C); 0.30 to 0.55 wt % of silicon (Si); 0.60 to 0.90 wt % of manganese (Mn); 0.025 wt % or less (excluding 0 wt %) of phosphorus (P); 0.008 wt % or less (excluding 0 wt %) of sulfur (S); 0.01 to 0.20 wt % of chromium (Cr); 0.08 wt % or less (excluding 0 wt %) of molybdenum (Mo); 0.25 wt % or less (excluding 0 wt %) of nickel (Ni); 0.01 to 0.20 wt % of vanadium (V); 0.20 wt % or less (excluding 0 wt %) of copper (Cu); 0.003 wt % or less (excluding 0 wt %) of titanium (Ti); 0.01 to 0.05 wt % of aluminum (Al); 0.0015 wt % or less (excluding 0 wt %) of oxygen (O); 0.001 wt % or less (excluding 0 wt %) of calcium (Ca); and iron (Fe) and unavoidable impurities as a remainder.

Bearing steel and manufacturing method therefor

A semiconductor package includes a connection structure, a semiconductor chip, and an encapsulant. The connection structure includes an insulating layer, a redistribution layer disposed on the insulating layer, and a connection via penetrating through the insulating layer and connected to the redistribution layer. The semiconductor chip has an active surface on which connection pads are disposed and an inactive surface opposing the active surface, and the active surface is disposed on the connection structure to face the connection structure. The encapsulant covers at least a portion of the semiconductor chip. The semiconductor chip includes a groove formed in the active surface and a dam structure disposed around the groove in the active surface.

Semiconductor package

A wearable electronic device includes: a flexible display divided into a plurality of blocks, at least one block among the plurality of blocks configured to be folded, and at least one magnetic element disposed at both ends of the at least one block configured to be folded, said magnetic element configured to connect unfolded blocks to each other from among the plurality of blocks by connecting both ends of the at least one block configured to be folded when the at least one block configured to be folded is folded.

Deformable wearable electronic device

According to one embodiment, a light-emitting element comprises: a first electrically-conductive semiconductor layer, a second electrically-conductive semiconductor layer; and an active layer which is disposed between the first electrically-conductive layer and the second electrically-conductive layer, and in which a well layer and a barrier layer are alternately laminated at least once. The active layer comprises: a first region which is disposed between a neighboring barrier layer and well layer, and linearly reduces the energy band gap; and a second region which is disposed between a neighboring well layer and barrier layer, and linearly increases the energy band gap. In the well layer, at least one first region and second region neighboring the same well layer have mutually different thicknesses.

Light-emitting device

Growing community of inventors

Seoul, South Korea

Seon Ho Lee