Samsung Electro-Mechanics Co., Ltd.

Seol Min Yi

Tae Hoon Kim

Jae Woo Joung

Ji Hoon Lee

Young Ah Song

Young Chang Joo

In Young Kim

Sung Il Oh

Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.

Method of forming metal wiring and metal wiring formed using the same

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Seoul, South Korea

Seol Min Yi