Samsung Electronics Co., Ltd.

Seok-Won Jeong

Jun-Young Ko

Chan-Sik Kwon

Jae-ho Choi

In a method of manufacturing a semiconductor package, a first semiconductor chip is adhered to a package substrate. An end portion of a wire is bonded to a first bonding pad of the first semiconductor chip by using a capillary. An operating voltage of the first semiconductor chip is applied to the first bonding pad through the wire to detect a leakage current. A second end portion of the wire is bonded to the first connection pad by using the capillary, according to a result of the detection.

Method of manufacturing a semiconductor package and wire bonding apparatus for performing the same

A test apparatus for a semiconductor package comprising an X-ray analyzer acquiring an X-ray image of the semiconductor package and detecting a thickness of the semiconductor package from the X-ray image, and a thermal reaction analyzer applying a voltage to the semiconductor package and detecting a failure position of the semiconductor package using a surface temperature of the semiconductor package and the thickness of the semiconductor package may be provided.

Growing community of inventors

Daejeon, South Korea

Seok-Won Jeong