Samsung Electro-mechanics Co., Ltd.

Seok Taek Jun

Duk Woo Lee

Ik Seo Choi

Myoung Lib Moon

Young Keun Lee

An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a second component disposed on the first surface of the substrate, a first sealing portion to seal the first component, a second sealing portion to seal the second component, a shielding wall disposed between the first component and the second component. The shielding wall includes a bobbin disposed between the first sealing portion and the second sealing portion and a conductive portion to seal the bobbin. A shielding layer of a conductive material is disposed along a surface formed by the first sealing portion, the second sealing portion, and the shielding wall.

Electronic device module and method of manufacturing the same

An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a first sealing portion sealing the at least one first component and a second sealing portion sealing the at least one second component, a shielding wall disposed between the at least one first component and the at least one second component to block a flow of electromagnetic waves, and a shielding layer of a conductive material disposed along a surface formed by the first and second sealing portions and the shielding wall. The shielding wall includes a first wall and a second wall spaced apart from each other, and the shielding layer is partially formed on opposing surfaces of the first wall and the second wall.

A ceramic multilayer substrate includes a plurality of ceramic substrates being stacked vertically, each substrate having a designated thickness; pattern layers formed on surfaces of the ceramic substrates so as to form circuit elements; external terminal vertically formed on side surfaces of the stacked ceramic substrates; and internal connection parts, each of which is formed on a part of one of the pattern layers, is connected to one of the external terminals so as to exchange signals with the outside, and is broad enough to surround at least partially the connected external terminal.

Ceramic multilayer substrate

A ceramic multilayer substrate is formed by vertically stacking and firing a plurality of ceramic sheets, in which a connection bar is vertically formed between internal patterns and an external terminal of each ceramic sheet, preventing metallic conductive layers of the internal patterns from being deformed during processing the external terminal. The ceramic multilayer substrate has pattern layers formed on surfaces of at least some of the ceramic sheets. At least one through hole is formed on the edges of the stacked ceramic sheets so as to be opened to the outside. An external terminal is formed on an inner wall of the through hole connected with the pattern layers, and directly contacting the connection bar, whereby the connection bar supports the electrical connection between the external terminal and the pattern layers.

Growing community of inventors

Suwon-si, South Korea

Seok Taek Jun