Samsung Electronics Co., Ltd.

Seok-Myong Kang

Youn-ho Choi

Shi-Yun Cho

Ho-Seong Seo

Se-Ho Park

Ki-Hyun Kim

Kyung-Wan Park

Ji-Hyun Jung

Young-Min Lee

Dae-Kwang Jung

Woo-Ram Lee

Yu-Su Kim

Byung-Jik Kim

Joon-Il Kim

In-Kuk Yun

Youn-Ho Choi

Joon-II Kim

A method for preventing a touch misrecognition includes counting a total number of touch detection values of a touch panel which is greater than or equal to a first threshold value; comparing the total number of touch detection values with a second threshold value; and when the total number of the touch detection values is greater than or equal to the second threshold value, determining that bending of the touch panel has occurred.

Method for preventing touch misrecognition, machine-readable storage medium, and portable terminal

Disclosed is a flexible display device adapted to accurately detect bending information when the flexible display device is flexed, bent or folded, and to be capable of variously controlling an image displayed on a screen on the basis of the detected bending information. The flexible display device includes a flexible touch screen part, and a bending detection part provided on the touch screen part, the bending detection part having an electrostatic capacitance or electric resistance that changes depending on a bending of the touch screen part, so as to detect bending information.

Flexible display device

An apparatus and method for improving input position and pressure detection in a pressure detection touch screen. The method includes detecting a touch input on a touch screen; generating compensated pressure information for compensating for inaccurate pressure information detected from the touch input, when the touch input is detected in an outer area on the touch screen; and generating compensated location information using the compensated pressure information.

Apparatus and method for improving input position and pressure detection in a pressure detection touch screen

An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.

Embedded circuit board and manufacturing method thereof

An internal antenna is provided that includes a first antenna having a first antenna pattern formed on a first dielectric layer, and a second antenna having a second antenna pattern formed on a second dielectric layer. The second dielectric layer has a higher dielectric constant than the first dielectric layer. The first and second antenna patterns are electrically connected to each other.

Internal antenna and portable communication terminal using the same

A signal transmitting/receiving antenna device for Radio Frequency Identification (RFID) which executes contactless data communication, and a method of manufacturing the same. The antenna device includes an antenna module including a dielectric film substrate, an antenna pattern which is a conductive pattern printed on the top and bottom sides of the dielectric film substrate, the top and bottom antenna pattern parts being connected to each other through one or more via holes extending through the dielectric film substrate, and top and bottom passivation layers formed on the dielectric film substrate to cover the top and bottom antenna pattern parts; and a radio wave absorbent printed on one of the top and bottom passivation layers of the antenna module.

Antenna device and method of manufacturing the same

A Printed Circuit Board (PCB) and a method for manufacturing the same are provided. A circuit pattern is formed by printing conductive ink/paste on a substrate, and sintering a layer of the conductive ink or curing a layer of the conductive paste by applying heat. A primary plating layer is formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern. A secondary plating layer is formed through electroless plating or electrolytic plating of a precious metal on the primary plating layer to improve wetting with solder.

Growing community of inventors

Gyeonggi-do, South Korea

Seok-Myong Kang