Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Seok Il Hong

Ju Hwan Yang

Jae Yeol Choi

Young Seuck Yoo

Jong Bong Lim

Doo Young Kim

Do Yeon Kim

Sung Woo Han

Byung Lyul Park

Hai Joon Lee

Chan Woo Park

Jee Won Lee

Yoon Su Kim

Dong Woo Shin

Seung Min Baek

Woong Sub Yim

A semiconductor package includes a semiconductor chip, and including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad of the semiconductor chip and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening, an encapsulant covering at least a portion of the semiconductor chip, and a connection structure disposed on the active surface of the semiconductor chip, and including a connection via connected to the connection pad in the first opening and the second opening and a redistribution layer electrically connected to the connection pad through the connection via. The second opening has a width narrower than a width of the first opening.

Semiconductor package

A thin film type coil component that includes a body having a coil embedded therein and including a composite of magnetic powder particles and a polymer, and external electrodes disposed on at least portions of external surfaces of the body. The body includes an upper body portion disposed on an upper surface of the coil, a lower body portion disposed on a lower surface of the coil, and a central body portion disposed between the upper body portion and the lower body portion and including a central portion of the coil. The upper body portion and the lower body portion include a stacked structure of a plurality of magnetic sheets, each magnetic sheet including the composite of the magnetic powder particles and the polymer.

Thin film type coil component

A coil component includes a body including coil patterns and a plurality of trenches; and external electrodes electrically connected to the coil patterns. The plurality of trenches include a magnetic material, and at least one edge of a trench disposed outside of an outermost coil pattern among the coil patterns has a same shape as an outside boundary portion of the outermost coil pattern adjacent thereto.

Coil component

A coil component and a method of manufacturing the coil component are provided. The coil component includes a coil part, a body, and an electrode. The coil part includes a support member, a first coil layer disposed on one surface of the support member, and a second coil layer disposed on the first coil layer. The body includes a magnetic material covering the coil part. The electrode is disposed on the body and is connected to the coil part. The first and second coil layers may each include an insulating layer having a pattern in a planar coil shape and a conductor layer disposed in the pattern and including a seed layer and a plating layer. Additionally, seed layers of the first and second coil layers may be disposed differently in the conductor layers of the first and second coil layers.

Coil component and method of manufacturing the same

A coil component includes a substrate and a coil pattern disposed on the substrate. The coil pattern includes a vertical region having a side surface perpendicular with respect to the substrate and a tapered region connected to the vertical region and having a side surface inclined with respect to the substrate.

A coil component includes: a coil part including a first coil layer and a second coil layer disposed above the first coil layer, wherein the first coil layer includes a first insulating layer having a first opening pattern and a first conductive layer disposed in the first opening pattern, and the second coil layer includes a second insulating layer having a second opening pattern, a seed layer covering inner side surfaces and a lower surface of the second opening pattern, and a second conductive layer disposed in the second opening pattern.

Disclosed is a support apparatus for a washing machine. The support apparatus includes a first adjustment unit coupled to a base, in which a coupling position of the first adjustment unit to the base is adjustable, and a second adjustment unit that is movable relative to the first adjustment unit.

Growing community of inventors

Suwon-si, South Korea

Seok Il Hong